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Substrate and mask aligning apparatus

  • US 7,788,061 B2
  • Filed: 07/24/2008
  • Issued: 08/31/2010
  • Est. Priority Date: 07/26/2007
  • Status: Active Grant
First Claim
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1. A substrate and mask aligning apparatus comprising:

  • a stage on which a substrate is loaded on one surface side such that a pad forming surface on which a plurality of pads are formed is directed upward and which is provided to move on a horizontal plane and provided to turn on a same plane;

    a mask in which through holes are formed in portions corresponding to pads on the substrate that is loaded on the stage;

    a connecting/disconnecting mechanism for connecting/disconnecting at least one of the substrate or the mask to/from the other;

    a shooting section for shooting a superposed state of the through holes of the mask on the pads of the substrate in a state that the mask is brought into contact with the pad forming surface of the substrate loaded on the stage; and

    a controlling portion for calculating stage moving data, which includes a moving direction and an amount of movement of the stage, on the basis of image data picked up by the shooting section to eliminate a difference between a present superposed state of the through holes of the mask, which comes into contact with the pad forming surface of the substrate loaded on the stage, on the pads of the substrate and a scheduled superposed state, and for executing repeatedly an operation to move the stage on the basis of calculated corrected moving data of the stage;

    wherein first moving data necessary for first alignment between positions of the through holes of the mask and the pad forming surface of the substrate is calculated on the basis of both the image data of the sole substrate obtained by shooting the pad forming surface in a state that the substrate is loaded on the stage and the image data of the sole mask obtained by shooting a plane state of the sole mask, andwherein the first moving data is calculated using data obtained in a state where no tension is applied to a mask, and the corrected moving data is calculated using data obtained in a state where a tension is applied to the mask.

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