Method of fabricating rotor assemblies having chemically bonded lamination stacks
First Claim
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1. A method of fabricating a rotor assembly, comprising:
- polishing a plurality of laminations of magnetic material;
removing carbon and impurities while annealing each of the polished laminations in a carbon removing atmosphere;
applying a metallic plating to the annealed laminations;
oxidizing the plated laminations by heating each of the plated laminations while exposed to air;
applying a dielectric chemical bonding agent to the surfaces of the oxidized laminations;
stacking the laminations;
applying the chemical bonding agent to spacers;
stacking the spacers at the end of the stacked laminations; and
applying a thermal cycle to the stacked laminations and spacers to cure the chemical bonding agent such that the laminations maintain a bond in operating temperatures over 1000°
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Abstract
A rotor assembly or other rotating device having a stack of laminations or laminates that are chemically bonded together. Chemical bond of the laminates may have a strength that approaches the strength of the material of metal laminates. Chemical bonds may be effective in holding the laminates at temperatures when subject to rigorous mechanical operations such as high rotation speed and vibration.
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Citations
2 Claims
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1. A method of fabricating a rotor assembly, comprising:
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polishing a plurality of laminations of magnetic material; removing carbon and impurities while annealing each of the polished laminations in a carbon removing atmosphere; applying a metallic plating to the annealed laminations; oxidizing the plated laminations by heating each of the plated laminations while exposed to air; applying a dielectric chemical bonding agent to the surfaces of the oxidized laminations; stacking the laminations; applying the chemical bonding agent to spacers; stacking the spacers at the end of the stacked laminations; and applying a thermal cycle to the stacked laminations and spacers to cure the chemical bonding agent such that the laminations maintain a bond in operating temperatures over 1000°
F. - View Dependent Claims (2)
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Specification