×

Methods and apparatus for assembling strong, lightweight thermal panel and insulated building structure

  • US 7,788,879 B2
  • Filed: 06/23/2005
  • Issued: 09/07/2010
  • Est. Priority Date: 03/18/2002
  • Status: Active Grant
First Claim
Patent Images

1. A structural panel for a building, comprising:

  • a plurality of I-beam stud members made of a metal having a thermal conductivity greater than 0.030 g-cal/(sec.) (sq. cm.) (degree C./cm) at 18 degrees C., each of the stud members having first and second flanges separated by a face which runs an entire length of each I-beam stud member, the first and second flanges having a thickness at least twice a thickness of the face, the first and second flanges being parallel to each other and perpendicular to the face, each I-beam stud member having a plurality of openings through the face separated by venturi bridges, the openings having a first width in a first region of the opening and a second width in a second region of the opening, the first width being greater than the second width, each I-beam stud member further having a plurality of circular openings through the face adjacent to the second width of the openings, the plurality of openings blocking thermal conduction between the first and second flanges such that thermal conduction between the first and second flanges occurs only through the venturi bridges for the entire length of each I-beam stud member, the face having an area in the range of 1.33 to 5 times a cumulative area of the plurality of openings and in the range of 10 to 25 times a cumulative area of the venturi bridges to reduce thermal conduction between the first and second flanges; and

    an insulating foam material disposed between the plurality of I-beam stud members, the insulating foam material being in contact with the face of the I-beam stud members.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×