Semiconductor acceleration sensor device and method for manufacturing the same

• US 7,788,976 B2
• Filed: 06/24/2009
• Issued: 09/07/2010
• Est. Priority Date: 06/18/2004
• Status: Expired due to Fees

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: Shizuno, Yoshinori
• Primary Examiner(s): Kwok; Helen C.
• Application Number:
  US12/490,411
• Publication Number:
  US 20090255340A1
• Time in Patent Office: 440 Days
• Field of Search: 734/93, 735/143.3, 735/143.6, 735/143.8, 735/143.4, 735/142.9, 735/141.6, 735/140.1
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Claims

1. A semiconductor acceleration sensor device comprising:

an acceleration sensor chip including;

a weight part, a support part which flexibly supports the weight part, one end of the support part being connected to the weight part, and a pedestal part surrounding the weight part, an opposite end of the support part being connected to the pedestal part;

an elastic first resin part to coat and to entirely cover the weight part and the support part;

a circuit chip provided over the acceleration sensor chip and electrically connected to the acceleration sensor chip; and

a second resin part to encapsulated the first resin part, the acceleration sensor ship and the circuit chip.

2. The semiconductor acceleration sensor device according to claim 1, wherein the first resin part extends between the acceleration sensor chip and the circuit chip.

3. The semiconductor acceleration sensor device according to claim 1 further comprising a wiring substrate provided on top of the circuit chip such that the wiring substrate is electrically connected to the circuit chip.

4. The semiconductor acceleration sensor device according to claim 1 further comprising a conductive part extending outward from the second resin part.

5. The semiconductor acceleration sensor device according to claim 1 further comprising a bottom lid part attached to a lower face of the acceleration sensor ship.

6. The semiconductor acceleration sensor device according to the claim 1, wherein said circuit chip includes a semiconductor circuit chip.

7. The semiconductor acceleration sensor device according to claim 1, wherein said first resin part includes a gel element.

8. The semiconductor acceleration sensor device according to claim 1, wherein said second resin part includes a thermoplastic resin.