Planar connector

• US 7,789,670 B2
• Filed: 03/24/2005
• Issued: 09/07/2010
• Est. Priority Date: 03/26/2004
• Status: Expired due to Fees

• Current Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Original Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Inventors: Watanabe, Kazufumi, Fukatsu, Hiroki, Ohshiba, Hirokazu, Shiwaku, Toshio
• Primary Examiner(s): Tarazano; D. L
• Assistant Examiner(s): Thompson; Camie S
• Application Number:
  US10/592,362
• Publication Number:
  US 20070197706A1
• Time in Patent Office: 1,993 Days
• Field of Search: None
• US Class Current: 439/66
• CPC Class Codes: G06F 9/4887 involving deadlines, e.g. rate based, periodic

Abstract

The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.

Claims

1. A planar connector including an outer frame and a lattice structure within the outer frame wherein the planar connector has a 2 mm or smaller pitch interval at the lattice area, a 0.5 mm or smaller thickness of the lattice area, and a 5.0 mm or smaller total height, the connector being constituted by (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between compounding quantity and weight-average length of the compounded (B) fibrous filler satisfying the interior portion of the area (D) defined as follows:

The area enclosed by following functions (1) through (5);

X=40 

 

(1)

X=53 

 

(2)

Y=160 

 

(3)

Y=360 

 

(4)

Y=(18222/X)−

84.44 

 

(5)

where, the X axis signifies the compounding quantity of (B) the fibrous filler (weight percentage of (B) in (C) the resin composition), and the Y axis signifies the weight-average length (μ

m) of (B) the fibrous filler.

2. The planar connector according to claim 1, wherein (C) the resin composition has 55 Pa·

s or smaller apparent melt viscosity determined by using a capillary rheometer having L=20 mm and d=1 mm, at 360°

C. and 1000/s of shear rate, conforming to ISO11443.

3. The planar connector according to claim 1, having 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C., and having 0.02 mm or smaller difference in flatness before and after the reflow.

4. The planar connector according to claim 1, wherein (C) the resin composition has an apparent melt viscosity of 55 Pa·

s or smaller, determined by using a capillary rheometer having L=20 mm and d=1 mm, at the temperature of 360°

C. at a shear rate of 1000/s according to ISO11443, and the planar connector has 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C. and has 0.02 mm or smaller difference in flatness before and after the reflow.

5. The planar connector according to claim 1, wherein (C) the resin composition has 55 Pa·

s or smaller apparent melt viscosity determined by using a capillary rheometer having L=20 mm and d=1 mm, at 360°

C. and 1000/s of shear rate, conforming to ISO11443.

6. The planar connector according to claim 1, having 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C., and having 0.02 mm or smaller difference in flatness before and after the reflow.

7. The planar connector according to claim 2, having 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C., and having 0.02 mm or smaller difference in flatness before and after the reflow.

8. The planar connector according to claim 5, having 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C., and having 0.02 mm or smaller difference in flatness before and after the reflow.

9. The planar connector according to claim 1, wherein (C) the resin composition has an apparent melt viscosity of 55 Pa·

s or smaller, determined by using a capillary rheometer having L=20 mm and d=1 mm, at the temperature of 360°

C. at a shear rate of 1000/s according to ISO11443, and the planar connector has 0.09 mm or smaller flatness before IR-reflow step for surface mounting at a peak temperature of 230°

C. to 280°

C. and has 0.02 mm or smaller difference in flatness before and after the reflow.

10. A planar connector according to claim 1, wherein there is an opening in the lattice area.