Manufacture of light-emitting panels provided with texturized micro-components

• US 7,789,725 B1
• Filed: 10/19/2007
• Issued: 09/07/2010
• Est. Priority Date: 10/27/2000
• Status: Active Grant

• Current Assignee: Leidos, Inc. (Leidos Holdings, Inc.)
• Original Assignee: Science Applications International Corporation
• Inventors: George, Edward Victor, Green, Albert Myron, Wyeth, Newell Convers
• Primary Examiner(s): Santiago; Mariceli
• Application Number:
  US11/976,037
• Time in Patent Office: 1,054 Days
• Field of Search: 313582-587, 445/24, 445/25
• US Class Current: 445/25
• CPC Class Codes: G02B 6/0033 Means for improving the coupling-out of light from the light guide
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects

Abstract

A method of forming micro-components is disclosed. The method includes pretesting and conditioning of the micro-components. The micro-components that fail testing or conditioning are discarded, and those remaining are assembled into a panel.

Claims

1. A web fabrication process for manufacturing a plurality of light-emitting panels, the process comprising the steps of:

providing a first substrate;

disposing a plurality of micro-components on the first substrate, each of the micro-components comprising a shell filled with a plasma-forming gas or gas mixture;

texturizing a portion of each of the plurality of micro-components;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

dicing the first substrate and the second substrate to form individual light-emitting panels.

2. The process of claim 1, wherein texturizing a portion of each of the plurality of micro-components is achieved by sandblasting the shell of the micro-component.

3. The process of claim 1, wherein texturizing a portion of each of the plurality of micro-components is achieved by etching the shell of the micro-component.

4. The process of claim 1, wherein texturizing a portion of each of the plurality of micro-components is achieved through lithography.

5. A web fabrication process for manufacturing a plurality of light-emitting panels, the process comprising the steps of:

providing a first substrate;

disposing a plurality of micro-components on the first substrate, each of said micro-components comprising a shell;

texturizing a portion of each of the plurality of micro-components, wherein said texturizing is achieved by sandblasting the shell of the micro-component;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

dicing the first substrate and the second substrate to form individual light-emitting panels.

6. A web fabrication process for manufacturing a plurality of light-emitting panels, the process comprising the steps of:

providing a first substrate;

disposing a plurality of micro-components on the first substrate, said micro-components comprising a shell;

texturizing a portion of each of the plurality of micro-components, wherein said texturizing is achieved by etching the shell of the micro-component;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

dicing the first substrate and the second substrate to form individual light-emitting panels.

7. A web fabrication process for manufacturing a plurality of light-emitting panels, the process comprising the steps of:

providing a first substrate;

disposing a plurality of micro-components on the first substrate, said micro-components comprising a shell;

texturizing the shell of each of the plurality of micro-components, wherein said texturizing is achieved through lithography;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

dicing the first substrate and the second substrate to form individual light-emitting panels.