Methods and apparatus for cleaning chamber components
First Claim
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1. A method of cleaning a semiconductor fabrication chamber component having an orifice comprising:
- placing the component into a bath having a cleaning solution;
injecting a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component;
controlling the amount of time the orifice is in contact with the cleaning solution; and
withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice;
wherein withdrawing the fluid from the orifice comprises applying a vacuum to the orifice.
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Abstract
In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.
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Citations
17 Claims
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1. A method of cleaning a semiconductor fabrication chamber component having an orifice comprising:
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placing the component into a bath having a cleaning solution; injecting a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; controlling the amount of time the orifice is in contact with the cleaning solution; and withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice; wherein withdrawing the fluid from the orifice comprises applying a vacuum to the orifice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of cleaning a semiconductor fabrication chamber component having an orifice comprising:
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placing the component into a bath having a cleaning solution; injecting a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans a second portion of the orifice; controlling the amount of time the orifice is in contact with the cleaning solution; and withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice; wherein withdrawing the fluid from the orifice comprises applying a vacuum to the orifice. - View Dependent Claims (14, 15, 16, 17)
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Specification