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Methods and apparatus for cleaning chamber components

  • US 7,789,969 B2
  • Filed: 10/31/2007
  • Issued: 09/07/2010
  • Est. Priority Date: 11/01/2006
  • Status: Active Grant
First Claim
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1. A method of cleaning a semiconductor fabrication chamber component having an orifice comprising:

  • placing the component into a bath having a cleaning solution;

    injecting a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component;

    controlling the amount of time the orifice is in contact with the cleaning solution; and

    withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice;

    wherein withdrawing the fluid from the orifice comprises applying a vacuum to the orifice.

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