Light emitting diode package with diffuser and method of manufacturing the same

• US 7,790,482 B2
• Filed: 02/12/2009
• Issued: 09/07/2010
• Est. Priority Date: 07/26/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Original Assignee: Samsung LED Co., Ltd. (Samsung Group)
• Inventors: Han, Seong Yeon, Park, Young Sam, Song, Chang Ho, Lee, Seon Goo, Han, Kyung Taeg, Park, Jung Kyu
• Primary Examiner(s): Pham; Hoai V
• Application Number:
  US12/370,194
• Publication Number:
  US 20090155938A1
• Time in Patent Office: 572 Days
• Field of Search: 438/22, 438/25, 438/26, 438/27, 438/29, 257/E21.527
• US Class Current: 438/22
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

Claims

1. A manufacturing method of a light emitting diode package comprising steps of:

providing a substrate with an electrode formed thereon;

mounting a light emitting diode chip on the substrate;

applying an encapsulant containing a diffuser to cover the light emitting diode chip; and

attaching a lens part on the encapsulant,

whereby light from the light emitting diode chip is emitted out of the package without distortion.

2. The light emitting diode package according to claim 1, wherein the diffusers comprises an opal based material.

3. The manufacturing method of a light emitting diode package according to claim 2, wherein the opal based material is one selected from a group consisting of barium titanate, titanium dioxide, aluminum oxide, and silicon dioxide and combinations thereof.