Light emitting diode package with diffuser and method of manufacturing the same
First Claim
1. A manufacturing method of a light emitting diode package comprising steps of:
- providing a substrate with an electrode formed thereon;
mounting a light emitting diode chip on the substrate;
applying an encapsulant containing a diffuser to cover the light emitting diode chip; and
attaching a lens part on the encapsulant,whereby light from the light emitting diode chip is emitted out of the package without distortion.
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Accused Products
Abstract
The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
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Citations
3 Claims
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1. A manufacturing method of a light emitting diode package comprising steps of:
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providing a substrate with an electrode formed thereon; mounting a light emitting diode chip on the substrate; applying an encapsulant containing a diffuser to cover the light emitting diode chip; and attaching a lens part on the encapsulant, whereby light from the light emitting diode chip is emitted out of the package without distortion. - View Dependent Claims (2, 3)
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Specification