Device structures for a metal-oxide-semiconductor field effect transistor and methods of fabricating such device structures
First Claim
1. A method of fabricating a device structure on an insulating layer, the method comprising:
- forming a first semiconductor body with a first sidewall that extends toward the insulating layer;
forming a second semiconductor body having a second sidewall that extends toward the insulating layer;
doping the first semiconductor body to form a source and a drain;
forming a gate dielectric layer extending to the insulating layer at a location between the first sidewall of the first semiconductor body and the second sidewall of the second semiconductor body; and
partially removing the second semiconductor body to define a gate electrode configured to control carrier flow in a channel between the source and the drain of the first semiconductor body,wherein the gate dielectric layer is formed by concurrently growing a first silicon dioxide layer on the first sidewall of the first semiconductor body and a second silicon dioxide on the second sidewall of the second semiconductor body with a thermal oxidation process.
3 Assignments
0 Petitions
Accused Products
Abstract
Device structures for a metal-oxide-semiconductor field effect transistor (MOSFET) that is suitable for operation at relatively high voltages and methods of forming same. The MOSFET, which is formed using a semiconductor-on-insulator (SOI) substrate, includes a channel in a semiconductor body that is self-aligned with a gate electrode. The gate electrode and semiconductor body, which are both formed from the monocrystalline SOI layer of the SOI substrate, are separated by a gap that is filled by a gate dielectric layer. The gate dielectric layer may be composed of thermal oxide layers grown on adjacent sidewalls of the semiconductor body and gate electrode, in combination with an optional deposited dielectric material that fills the remaining gap between the thermal oxide layers.
-
Citations
9 Claims
-
1. A method of fabricating a device structure on an insulating layer, the method comprising:
-
forming a first semiconductor body with a first sidewall that extends toward the insulating layer; forming a second semiconductor body having a second sidewall that extends toward the insulating layer; doping the first semiconductor body to form a source and a drain; forming a gate dielectric layer extending to the insulating layer at a location between the first sidewall of the first semiconductor body and the second sidewall of the second semiconductor body; and partially removing the second semiconductor body to define a gate electrode configured to control carrier flow in a channel between the source and the drain of the first semiconductor body, wherein the gate dielectric layer is formed by concurrently growing a first silicon dioxide layer on the first sidewall of the first semiconductor body and a second silicon dioxide on the second sidewall of the second semiconductor body with a thermal oxidation process. - View Dependent Claims (2, 3, 4, 5, 7, 8, 9)
-
-
6. A method of fabricating a device structure on an insulating layer, the method comprising:
-
forming a first semiconductor body with a first sidewall that extends toward the insulating layer; forming a second semiconductor body having a second sidewall that extends toward the insulating layer; doping the first semiconductor body to form a source and a drain; forming a gate dielectric layer extending to the insulating layer at a location between the first sidewall of the first semiconductor body and the second sidewall of the second semiconductor body; and partially removing the second semiconductor body to define a gate electrode configured to control carrier flow in a channel between the source and the drain of the first semiconductor body; and non-concurrently forming another device structure on the insulating layer that includes a gate dielectric layer thinner than the gate dielectric layer of the device structure.
-
Specification