Image sensor packages and frame structure thereof
First Claim
1. An image sensor package, comprising:
- a frame having upper and lower surfaces and substantially planar outer side surfaces;
an aperture extending from the upper surface to the lower surface and having a lower inverted step surrounding the aperture, an upper step extending entirely around a periphery of the aperture and at least another upper step extending entirely around the periphery of the aperture;
a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the active surface joined to the lower inverted step, the lateral sides substantially covered by a skirt portion of the frame; and
an optically transmissive window disposed in the aperture and secured to the upper step.
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0 Petitions
Accused Products
Abstract
A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used.
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Citations
41 Claims
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1. An image sensor package, comprising:
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a frame having upper and lower surfaces and substantially planar outer side surfaces; an aperture extending from the upper surface to the lower surface and having a lower inverted step surrounding the aperture, an upper step extending entirely around a periphery of the aperture and at least another upper step extending entirely around the periphery of the aperture; a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the active surface joined to the lower inverted step, the lateral sides substantially covered by a skirt portion of the frame; and an optically transmissive window disposed in the aperture and secured to the upper step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An image sensor package, comprising:
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a frame having upper and lower surfaces and substantially planar outer side surfaces; an aperture extending from the upper surface to the lower surface and having at least a first step and at least another, higher step surrounding the aperture; a semiconductor die having a surface including an optically active region, a back side opposite the optically active region and lateral sides, the semiconductor die substantially disposed in the aperture with the back side joined to the at least a first step, the lateral sides substantially covered by a skirt portion of the frame; and an optically transmissive window disposed in the aperture and secured to the at least another, higher step. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. An image sensor package, comprising:
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a frame having upper and lower surfaces and substantially planar outer side surfaces; an aperture extending from the upper surface to the lower surface and having a lower inverted step surrounding the aperture; a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the active surface joined to the lower inverted step, the lateral sides substantially covered by a skirt portion of the frame; an optically transmissive window disposed over the semiconductor die; a spacer disposed on the optically transmissive window and at least substantially aligned with the frame; and another optically transmissive window disposed over the spacer and adjacent the upper surface of the frame.
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40. An image sensor package, comprising:
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a frame having upper and lower surfaces and substantially planar outer side surfaces; an aperture extending from the upper surface to the lower surface; a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed under the aperture with the active surface abutting and secured to the lower surface of the frame; an optically transmissive window disposed within the aperture; a spacer disposed on the optically transmissive window and at least substantially aligned with the frame; and another optically transmissive window disposed over the spacer and having a surface substantially coplanar with the upper surface of the frame.
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41. An image sensor package, comprising:
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a frame having upper and lower surfaces and substantially planar outer side surfaces; an aperture extending from the upper surface to the lower surface and having at least a first step surrounding the aperture; a semiconductor die having a surface including an optically active region, a back side opposite the optically active region and lateral sides, the semiconductor die substantially disposed in the aperture with the back side joined to the at least a first step, the lateral sides substantially covered by a skirt portion of the frame; and an optically transmissive window disposed over and secured to the upper surface of the frame.
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Specification