Configurable networked user interface and switch pack

• US 7,791,506 B2
• Filed: 03/30/2007
• Issued: 09/07/2010
• Est. Priority Date: 03/30/2007
• Status: Active Grant

• Current Assignee: ZF Friedrichshafen AG (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Original Assignee: ZF Friedrichshafen AG (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Mattson, Daniel, Dale, Richard L., Keimig, Michelle D., Riihimaki, Roy E.
• Primary Examiner(s): WONG, ALBERT KANG
• Application Number:
  US11/693,940
• Publication Number:
  US 20080238650A1
• Time in Patent Office: 1,257 Days
• Field of Search: 341/20, 341/22, 341/32, 341/34, 361/679.4, 200/19.36, 200/404, 335205-207
• US Class Current: 341/32
• CPC Class Codes: G01D 5/2006 by influencing the self-induction of one or more coils G01D5/22 takes precedence
• CPC Class Codes: G06F 3/0202 Constructional details or processes of manufacture of the input device
• CPC Class Codes: H03K 17/97 using a magnetic movable element
• CPC Class Codes: H03K 2017/9706 Inductive element
• CPC Class Codes: H03K 2217/94068 with magnetic detection
• CPC Class Codes: H03K 2217/94094 Wired transmission, e.g. via bus connection or similar

Abstract

A printed circuit board (PCB) has a plurality of switch interfaces on its top surface. Each interface is an array of sensors, such as proximity sensors, hall-effect sensors, or a series of inductor coils. The sensors in each array are closely mounted and are all the same for a given PCB. Each array may or may not mount a non-contacting switch selected from a plurality of different types of switches, such as a single push button switch, dual push button switch, a toggle switch, a 3-position rocker switch, a rotary switch, or other type switch. Each switch mounted on the PCB includes one or more indicators for sensing by the sensors or coils, with feedback to determine what type of switch is mounted in each position. The same PCB, or other mount, may thus be used for a variety of unique applications, such as switch packs used in vehicles.

Claims

1. A configurable network switch pack, comprising:

a plurality of arrays of inductive coils, wherein each array comprises at least a first coil for detecting an object for identification and at least a second coil for detecting an object for actuation, each array configured for interfacing with a switch without contact with the switch, wherein the coils are arranged in a pattern in a planar manner on a substrate;

a plurality of switches wherein each switch of the plurality of switches is located above a corresponding array, each switch comprising at least one object for identification and at least one object for actuation, wherein each array is configured for sensing the objects for identification and actuation; and

a microcontroller located on the substrate and in communication with the arrays, wherein each array is associated with one of the plurality of switches, one at a time, by programming the microcontroller, and wherein the microcontroller is configured for determining the identification of each switch by sensing the object for identification and for determining a position of each switch by sensing the object for actuation.

2. The switch pack of claim 1, wherein the objects are pieces of metal or magnets.

3. The switch pack of claim 1, further comprising a multiplexing circuit connected to the arrays for communication with the microcontroller.

4. The switch pack of claim 1, further comprising a cover for the printed circuit board, the cover configured for mounting the plurality of switches or plates.

5. The switch pack of claim 1, wherein the switch pack is configured for connection to a network using a network protocol selected from the group consisting of RS232, Linear Area Network and a Controller Area Network.

6. A configurable network switch pack, comprising:

a switch housing;

a plurality of arrays of inductive coils, wherein each array comprises at least a first coil for detecting an object for identification and at least a second coil for detecting an object for actuation, each array configured for interfacing without contact with at least two switches, wherein the arrays are arranged in a pattern in a planar manner on a substrate within the housing;

a plurality of switches located above the printed circuit board, each switch located above a particular array and each switch comprising at least one object for identification and at least one object for actuation for being sensed by at least two different coils in the particular array above which it is located;

a microcontroller connected to the plurality of arrays; and

a multiplexing circuit connecting each of the arrays with the microcontroller, wherein the multiplexing circuit is configured for sequentially interfacing each array with the microcontroller to determine an identification and a position of each switch using the at least two objects, and wherein the microcontroller is programmed for the identification of each switch by a pattern of the coils that are activated by at least one of the at least two objects and wherein the position of each switch is determined by a pattern of the coils that are activated by at least the other of the at least two objects.

7. The switch pack of claim 6, wherein the microcontroller is configured for a one wire or two wire output to a network connecting the switches to portions of a vehicle.

8. The switch pack of claim 6, further comprising an oscillator connected to the coils for sensing the objects.

9. The switch pack of claim 6, wherein the objects are selected from the group consisting of a metal, a magnet, and a magnetically-conductive material.

10. The switch pack of claim 6, further comprising a display for the switch pack, the display connected to at least the microcontroller and configured for displaying the identification and the position of the switches.

11. The switch pack of claim 6, wherein at least one switch further comprises a lamp.

12. A configurable network switch pack, comprising:

a switch housing;

a plurality of arrays of proximity sensors, wherein each array comprises at least a first proximity sensor for detecting an object for identification and at least a second proximity sensor for detecting an object for actuation, each array configured for interfacing without contact with at least two different switches, wherein the arrays are arranged in a pattern in a planar manner on a printed circuit board within the housing;

a plurality of switches located within the housing above the printed circuit board, each switch above a particular array and each switch further comprising at least one means for identification and at least one means for actuation for interfacing with the proximity sensors of the particular array above which it is located;

a microcontroller connected to the plurality of arrays;

an oscillator connected to the proximity sensors and configured for activation of the proximity sensors; and

a multiplexing circuit connecting each of the arrays with the microcontroller, wherein the microcontroller is configured to determine an identification and a position of each of the plurality of switches.

13. The switch pack of claim 12, wherein the proximity sensors are capacitance sensors, hall effect sensors, magnet-detecting sensors, or inductance sensors.

14. The switch pack of claim 12, wherein the arrays and the switches are arranged in a single line or in two lines.

15. The switch pack of claim 12, wherein the switches are selected from the group consisting of a toggle switch, a rotary switch, a push button switch, a rocker switch, a linear slider switch, and a thumb wheel switch.

16. A configurable network switch pack, comprising:

a switch housing;

a printed circuit board comprising a plurality of arrays of proximity sensors located in a planar manner on the board, wherein each array comprises at least a first proximity sensor for detecting an object for identification and at least a second proximity sensor for detecting an object for actuation, the board further comprising a microcontroller, an oscillator, and a circuit for sequentially connecting the microcontroller with the arrays of sensors;

a plurality of switches configured for interfacing with the plurality of arrays, each switch located above one of the plurality of arrays; and

a first device for identification and a second device for actuation located on each of the plurality of switches, the devices configured for detection by the sensors without contacting the sensors, and each switch configured so that a change of position of the switch alters a position of at least the device for actuation.

17. The switch pack of claim 16, wherein the plurality of switches comprises at least two different types of switches.

18. The switch pack of claim 16, wherein the device is selected from the group consisting of a metal, a magnetic material, a magnetically conductive metal, and a magnet.

19. A method of using a switch pack, the method comprising:

configuring a switch pack having at least two switches, each switch located above an array of proximity sensors and configured for contactless operation, the switch pack comprising a substrate on which each array of proximity sensors is located in a planar manner and wherein each array comprises at least a first proximity sensor for detecting an object for identification and at least a second proximity sensor for detecting an object for actuation;

exciting at least one proximity sensor from the array of proximity sensors;

determining an identification of each switch by detecting a presence of at least one identification indicator from each switch;

determining a position of at least one switch by detecting and sensing at least one actuation indicator from the at least one switch; and

operating a device selected from the group consisting of a vehicle, a piece of equipment, or machinery by using an output from the switch pack for the at least one switch.

20. The method of claim 19, further comprising displaying a status of at least one switch or an operating parameter of the device.

21. The method of claim 19, further comprising using a microcontroller and a multiplexing circuit to sequentially query the proximity sensors and detect the positions of the indicators.

22. The method of claim 19, further comprising programming the microcontroller with an identification pattern and an actuation pattern of the at least two switches.

23. The method of claim 19, wherein the at least two switches comprise two different types of switches.

24. The method of claim 19, wherein the proximity sensors are induction coils and wherein the indicators are lengths of metal or small magnets.

25. The method of claim 19, wherein the proximity sensors are capacitance sensors, hall effect sensors, magnet-detecting sensors, or inductance sensors.