Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use
First Claim
1. A probe card for testing a photonic integrated circuit formed on a semiconductor wafer, the photonic integrated circuit including a plurality of electro-optic components and a plurality of electrical contacts, the probe card comprising:
- a probe card body having a plurality of downwardly dependent, electrically conductive contact probes, the plurality of contact probes being configured to engage the plurality of electrical contacts; and
circuitry coupled to the plurality of contact probes, the circuitry being configured to sense an output of one of the plurality of electro-optic components via one of the plurality of contact probes,wherein the photonic integrated circuit is one of a plurality of photonic integrated circuits, the plurality of photonic integrated circuits being provided on the surface of the semiconductor wafer, each of the plurality of integrated circuits being associated with a corresponding one of a plurality of dies obtained by cleaving the semiconductor wafer,wherein the circuitry stores identification information associated with each of the plurality of dies.
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Accused Products
Abstract
Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.
103 Citations
9 Claims
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1. A probe card for testing a photonic integrated circuit formed on a semiconductor wafer, the photonic integrated circuit including a plurality of electro-optic components and a plurality of electrical contacts, the probe card comprising:
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a probe card body having a plurality of downwardly dependent, electrically conductive contact probes, the plurality of contact probes being configured to engage the plurality of electrical contacts; and circuitry coupled to the plurality of contact probes, the circuitry being configured to sense an output of one of the plurality of electro-optic components via one of the plurality of contact probes, wherein the photonic integrated circuit is one of a plurality of photonic integrated circuits, the plurality of photonic integrated circuits being provided on the surface of the semiconductor wafer, each of the plurality of integrated circuits being associated with a corresponding one of a plurality of dies obtained by cleaving the semiconductor wafer, wherein the circuitry stores identification information associated with each of the plurality of dies. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for testing a photonic integrated circuit provided on a semiconductor wafer, the photonic integrated circuit including a plurality of electro-optic components, and a plurality of electrical contacts, the method comprising the steps of:
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translating a probe card body having a plurality of downwardly dependent, electrically conductive contact probes over a surface of the semiconductor wafer to position the probe card adjacent the photonic integrated circuit; contacting the plurality of electrical contacts with the plurality of contact probes; sensing an output from one of the plurality of electro-optic components via one of the plurality of contact probes, the output being indicative of a parameter associated with said one of the plurality of electro-optic components; and storing data associated with the parameter, wherein the photonic integrated circuit is one of a plurality of integrated circuits, the method further including; cleaving the semiconductor wafer into a plurality of die, each of the plurality of photonic integrated circuits being provided on a corresponding one of the plurality of die; and retaining the data after said step of cleaving the semiconductor wafer into the plurality of die. - View Dependent Claims (8, 9)
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Specification