Planar resonator gyroscope central die attachment
First Claim
1. A packaged resonator gyroscope, comprising:
- a planar resonator die including a baseplate and a planar resonator centrally mounted to the baseplate having a plurality of embedded capacitive electrodes coupled to a top side of the baseplate; and
a package attached to a bottom side of the baseplate of the planar resonator die only in a central region substantially excluded from a projected area of the plurality of the embedded capacitive electrodes coupled to the top side of the baseplate to avoid stress that would induce gap nonuniformity of the embedded capacitive electrodes under temperature changes;
wherein the plurality of the embedded capacitive electrodes are within slots in the planar resonator.
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Abstract
Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. A gyroscope die may be attached to its package substrate on a central disc area that is inboard of its embedded electrodes. This configuration eliminates contact of the die with the package substrate beneath the embedded electrodes allowing the internal electrode support structure to expand or contract freely without stress as its temperature changes. The central attachment can also be used diminish the package temperature gradients on the periphery of the die, if the thermal conductivity of the central disc attachment material is higher than the package substrate. Temperature gradients across the resonator also lead to thermoelastic damping asymmetry and rate drift. In addition, the electrical connections to the die may be formed by vertical vias within the central disc attachment area or by thin wirebonds to peripheral I/O pads on the gyro chip.
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Citations
20 Claims
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1. A packaged resonator gyroscope, comprising:
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a planar resonator die including a baseplate and a planar resonator centrally mounted to the baseplate having a plurality of embedded capacitive electrodes coupled to a top side of the baseplate; and a package attached to a bottom side of the baseplate of the planar resonator die only in a central region substantially excluded from a projected area of the plurality of the embedded capacitive electrodes coupled to the top side of the baseplate to avoid stress that would induce gap nonuniformity of the embedded capacitive electrodes under temperature changes; wherein the plurality of the embedded capacitive electrodes are within slots in the planar resonator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of packaging a planar resonator gyroscope, comprising the steps of:
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providing a planar resonator die including a baseplate and a planar resonator centrally mounted to the baseplate having a plurality of the embedded capacitive electrodes coupled to a top side of the baseplate; providing a package for supporting the planar resonator die; and attaching the package to a bottom side of the baseplate of the planar resonator die only in a central region substantially excluded from a projected area of the plurality of the embedded capacitive electrodes coupled to the top side of the baseplate to avoid stress that would induce gap nonuniformity of the embedded capacitive electrodes under temperature changes; wherein the plurality of the embedded capacitive electrodes are within slots in the planar resonator. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A packaged resonator gyroscope, comprising:
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a planar resonator die means for sensing rotation including a baseplate and a planar resonator centrally mounted to the baseplate having a plurality of embedded capacitive electrodes coupled to a top side of the baseplate; a package means for supporting the planar resonator die means; and a bonding means for attaching the package means to a bottom side of the baseplate of the planar resonator die means only in a central region substantially excluded from a projected area of the plurality of the embedded capacitive electrodes coupled to the top side of the baseplate to avoid stress that would induce gap nonuniformity of the embedded capacitive electrodes under temperature changes; wherein the plurality of the embedded capacitive electrodes are within slots in the planar resonator. - View Dependent Claims (20)
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Specification