×

Thermal and coductivity sensing systems, devices and methods

  • US 7,794,141 B2
  • Filed: 04/13/2007
  • Issued: 09/14/2010
  • Est. Priority Date: 04/14/2006
  • Status: Active Grant
First Claim
Patent Images

1. A sensing probe comprising:

  • a probe housing having a proximal portion and a distal portion;

    a thermal sensor in said probe housing having a sensing end and a connector end, the sensing end positioned nearer to the distal portion than the proximal portion of the probe housing;

    a probe tip, which is more thermally conductive than the probe housing, attached to the distal portion of the probe housing and thermally coupled to said sensing end of the thermal sensor, wherein the probe tip is adapted for reversibly contacting and thermally coupling with an inner surface of a thermal well; and

    at least two leads connected to said connector end of said thermal sensor, wherein upon reversibly contacting and thermally coupling the probe tip to the thermal well, thermal energy is transferred from said thermal well, through the probe tip and to said thermal sensor resulting in temperature information being conveyed through the at least two leads towards the proximal portion of the probe housing.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×