Forming fastening projections on rigid substrates

• US 7,794,559 B2
• Filed: 05/14/2007
• Issued: 09/14/2010
• Est. Priority Date: 03/14/2000
• Status: Expired due to Fees

• Current Assignee: Velcro IP Holdings LLC
• Original Assignee: Velcro Industries BV (Chartwell Industries Ltd)
• Inventors: Tachauer, Ernesto S., Clune, William P., Banker, Shawn C.
• Primary Examiner(s): Del Sole; Joseph S.
• Assistant Examiner(s): STEWART, KIMBERLY ANN
• Application Number:
  US11/748,427
• Publication Number:
  US 20070264482A1
• Time in Patent Office: 1,219 Days
• Field of Search: 264/481, 264/166, 156/245
• US Class Current: 156/245
• CPC Class Codes: A44B 18/0049 obtained by moulding processes compression moulding or articles of indefinite length characterised by the shape of the surface B29C43/222; screen moulding B29C67/08
• CPC Class Codes: B29C 2043/461 the rollers having specific surface features
• CPC Class Codes: B29C 43/222 characterised by the shape of the surface
• CPC Class Codes: B29C 43/28 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• CPC Class Codes: B29C 43/46 Rollers
• CPC Class Codes: B29L 2031/729 Hook and loop-type fasteners
• CPC Class Codes: Y10T 428/249923 Including interlaminar mechanical fastener

Abstract

Rigid substrates having molded fastener projections, and methods of making the same are disclosed. A substrate has a beam stiffness, measured as a product of an overall moment of inertia of a nominal transverse cross-section and an effective modulus of elasticity of a material from which the substrate is made, that is greater than about 200 lb-in² (0.574 N-m²). In situ lamination of hook, bands or islands on surfaces of a rigid substrate held in a planar orientation or presenting a planar surface.

Claims

1. A method of forming fastening projections on a rigid substrate, the method comprising:

delivering a resin to an outer surface of a rigid substrate;

molding from the resin an array of discrete stems in cavities defined in a peripheral surface of a mold roll rolled over the surface of the substrate, the stems withdrawing from their cavities by continuous rotation of the mold roll while the substrate remains rigid, leaving the stems projecting from the surface of the substrate;

bonding the resin to the outer surface of the substrate; and

forming fastening heads at distal ends of the stems,

wherein the substrate comprises one or more members selected from the group consisting of a wallboard, a window frame, a wall panel, a floor tile, and a ceiling tile.

2. The method of claim 1, wherein the molding and bonding comprise generating sufficient pressure between the substrate and the mold roll to at least partially fill the cavities in the mold roll with the resin while bonding the resin to the substrate.

3. The method of claim 2, wherein the discrete projecting stems are molded to extend integrally from a common layer of the resin bonded to the substrate.

4. The method of claim 2, wherein the resin penetrates the surface of the substrate through pores or fiber interstices in the surface of the substrate.

5. The method of claim 1, wherein the resin is delivered and the array bonded so as to form a discrete band or island of projections on the substrate.

6. The method of claim 1, wherein the cavities are shaped to form the fastening heads on the stems as the stems are molded, the fastening heads deforming as they are withdrawn from the cavities.

7. The method of claim 1, wherein the resin is delivered to the substrate by the mold roll.

8. The method of claim 1, comprising introducing the substrate to a gap defined between the mold roll and a counter-rotating pressure roll.

9. The method of claim 8, wherein the pressure roll or the mold roll defines a groove to accommodate a shape of the substrate.

10. The method of claim 8, wherein the mold roll and pressure roll are interconnected on one side of the gap, with an opposite side of the gap open for accommodating wide substrates, the method forming fastener projections along an edge region of the substrate while an opposite edge of the substrate extends beyond the mold roll.

11. The method of claim 1, comprising selecting whether the discrete projections are bonded directly to the surface of the substrate or whether the discrete projections extend integrally from a layer of resin bonded to the surface of the substrate and then choosing an amount of resin to be delivered in consideration of such selection.

12. The method of claim 1, wherein the substrate comprises rigid building material.

13. The method of claim 1, further comprising heating the resin between delivering the resin and one of the molding and bonding steps.

14. The method of claim 1, where the resin is delivered into a nip formed between the mold roll and the substrate.

15. The method of claim 1, wherein a pre-arranged pattern of resin is delivered to be aligned with a pre-arranged pattern of cavities in the mold roll.

16. The method of claim 1, wherein the resin is delivered to form separated array bands of projections and the resin is molded into the separated array bands by a continuous pattern of cavities in the mold roll.

17. The method of claim 1, wherein the discrete projections are molded in the form of hooks.

18. The method of claim 1, wherein the resin is delivered directly into the cavities in the mold roll and the resin is then bonded to the substrate.

19. The method of claim 18, comprising delivering additional resin to the peripheral surface of the mold roll to form a base layer, such that the discrete projections extend integrally from the base layer of resin which is bonded to the substrate.

20. The method of claim 18 wherein the discrete projections are individually bonded to the surface of the substrate without any additional resin bonded between the projections to the surface of the substrate.

21. The method of claim 1, wherein the resin is delivered to the substrate before filling the cavities of the mold roll.

22. The method of claim 1, wherein the molding and bonding occur simultaneously in response to pressure between the mold roll and the substrate surface.

23. The method of claim 1, wherein the substrate has a beam stiffness, measured as a product of an overall moment of inertia of a nominal cross-section of the substrate and an effective modulus of elasticity of a material from which the substrate is formed, that is greater than about 200 lb-in².

24. The method of claim 23, wherein the beam stiffness is greater than 1,000 lb-in².

25. The method of claim 1, wherein the method comprises passing the substrate through a nip defined between the mold roll and a pressure roll and introducing the resin into the nip, wherein a portion of the substrate extends laterally beyond the mold roll when the substrate is passed through the nip.

26. The method of claim 25, wherein the mold roll has first and second end portions and the pressure roll has third and fourth end portions, the first and second end portions of the mold roll and the third and fourth end portions of the pressure roll are rotatably coupled to a frame, and the frame forms a slot through which the substrate extends when the substrate is passed through the nip such that a portion of the substrate extends laterally beyond the frame and the mold and pressure rolls as the substrate passes through the nip.

27. The method of claim 25, wherein the mold roll has a first end portion rotatably attached to a frame and second end portion detached from the frame in a cantilevered arrangement, and the cantilevered arrangement of the first cylindrical roll allows the substrate to extend laterally beyond the frame and the mold roll as the substrate passes through the nip.

28. A method of forming fastening projections on a rigid substrate, the method comprising:

delivering a resin to an outer surface of a rigid substrate;

molding from the resin an array of discrete stems in cavities defined in a peripheral surface of a mold roll rolled over the surface of the substrate, the stems withdrawing from their cavities by continuous rotation of the mold roll while the substrate remains rigid, leaving the stems projecting from the surface of the substrate;

bonding the resin to the outer surface of the substrate; and

forming fastening heads at distal ends of the stems,

wherein the resin is delivered directly into the cavities in the mold roll and the resin is then bonded to the substrate, and wherein the discrete projections are individually bonded to the surface of the substrate without any additional resin bonded between the projections to the surface of the substrate.