Multi-station deposition apparatus and method
First Claim
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1. A method of depositing a material on a wafer comprising:
- positioning a first wafer in a first deposition position within a vacuum deposition chamber;
introducing a first deposition gas proximate the first wafer, the first deposition gas provided by flowing the first deposition gas in a first direction;
flowing a separation gas in a second direction that is different than the first direction between the first deposition position and a second deposition position within the vacuum deposition chamber;
moving the first wafer to the second deposition; and
introducing a second deposition gas proximate the first wafer.
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Abstract
A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.
18 Citations
10 Claims
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1. A method of depositing a material on a wafer comprising:
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positioning a first wafer in a first deposition position within a vacuum deposition chamber; introducing a first deposition gas proximate the first wafer, the first deposition gas provided by flowing the first deposition gas in a first direction; flowing a separation gas in a second direction that is different than the first direction between the first deposition position and a second deposition position within the vacuum deposition chamber; moving the first wafer to the second deposition; and introducing a second deposition gas proximate the first wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification