Method, system, and apparatus for transfer of dies using a die plate having die cavities

• US 7,795,076 B2
• Filed: 06/14/2004
• Issued: 09/14/2010
• Est. Priority Date: 06/12/2003
• Status: Active Grant

• Current Assignee: Symbol Technologies, LLC (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Primary Examiner(s): Stark; Jarrett J
• Application Number:
  US10/866,150
• Publication Number:
  US 20050009232A1
• Time in Patent Office: 2,283 Days
• Field of Search: 438/464, 438/110, 257/E21.499, 257/E21.603
• US Class Current: 438/110
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: G11B 23/0021 discs
• CPC Class Codes: G11B 23/0042 with provision for auxiliary features sensing such features G11B17/00, G11B19/02
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 438/976 : Temporary protective layer
• CPC Class Codes: Y10T 156/1075 : of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1142 : Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
• CPC Class Codes: Y10T 156/1179 : with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 156/1906 : Delaminating means responsive to feed or shape at delamination
• CPC Class Codes: Y10T 156/1978 : Delaminating bending means
• CPC Class Codes: Y10T 156/1983 : Poking delaminating means
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 : Punching, piercing or reaming part by surface of second part
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53187 : Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

A method, system, and apparatus for transfer of dies using a die plate having die cavities is described herein. The die plate has a planar body. The body has a plurality of cells or cavities which are open at the first surface of the body. Each cell has a hole extending from the bottom surface of the cell to a second surface of the body. A wafer or support structure can be positioned to be closely adjacent to each other. A suction can be applied to the second surface of the die plate so that a plurality of dies can be transferred into a plurality of cells of the die plate. The dies can subsequently be transferred from the die plate having die cavities to one or more destination substrates or surfaces, by a punching mechanism.

Claims

1. A method for simultaneously transferring a plurality of integrated circuit dies that are attached to a support structure to a die receptacle structure having a plurality of cells, each cell open at a first surface of the die receptacle structure, comprising:

(a) positioning the support structure and die receptacle structure to be closely adjacent to each other such that each die of the plurality of integrated circuit dies attached to the support structure is simultaneously aligned with a corresponding cell of the plurality of cells;

(b) simultaneously positioning each aligned die of the plurality of integrated circuit dies attached to the support structure within the corresponding cell of the plurality of cells, wherein a bottom interior surface of each cell has an adhesive material; and

(c) simultaneously releasing the plurality of aligned integrated circuit dies from the support structure so that each die resides inside the corresponding cell of the plurality of cells and moving apart the support structure and die receptacle structure;

(d) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface of the die receptacle structure corresponding to each cell and applying a positive pressure at a first surface of the support structure, wherein portions of the die receptacle structure around cells are substantially sharp, wherein step (d) comprises;

allowing the applied suction and the positive pressure to cause the sharp portions of the die receptacle structure to cut the support structure around each die of the plurality of dies, such that each die of the plurality of aligned dies is separated from the support structure and is transferred into the corresponding cell of the plurality of cells by the applied suction.

2. The method of claim 1, wherein said moving step comprises:

moving apart the support structure and die receptacle structure so that each die remains in the corresponding cell due to the adhesive material overcoming an adhesiveness of the support structure.

3. The method of claim 2, wherein the support structure is a tape structure, wherein said moving step comprises:

peeling the support structure from the die receptacle structure.

4. The method of claim 1, wherein a first surface of each die is attached to the support structure, further comprising:

(e) prior to step (a), applying an adhesive material to a second surface of each die of the plurality of dies.

5. The method of claim 1, comprising

peeling the support structure from the die receptacle structure.

6. A method for transferring a plurality of integrated circuit dies that are attached to a support structure to a die receptacle structure having a plurality of cells, each cell open at a first surface of the die receptacle structure, comprising:

(a) positioning the support structure and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure is positioned inside a corresponding cell of the plurality of cells, wherein a bottom interior surface of each cell has an adhesive material;

(b) releasing each die of the plurality of dies from the support structure so that each die resides inside the corresponding cell of the plurality of cells, wherein releasing each die of the plurality of dies includes;

moving apart the support structure and die receptacle structure;

applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface corresponding to each cell; and

(c) applying a positive pressure at a first surface of the support structure, wherein portions of the die receptacle structure around cells are substantially sharp, wherein step (d) comprises;

allowing the applied suction and the positive pressure to cause the sharp portions of the die receptacle structure to cut the support structure around each die of the plurality of dies, such that each die of the plurality of dies is separated from the support structure and is transferred into the corresponding cell of the plurality of cells by the applied suction.