Leadframe package for MEMS microphone assembly
First Claim
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1. A method of manufacturing a pre-molded leadframe for use in a cavity semiconductor package, the method comprising:
- providing a die pad and a plurality of terminal lands;
providing one or more tie bars extending between the die pad and an outer frame portion;
molding a material about the die pad and the terminal lands to form a substrate having the outer frame portion, a top surface and a bottom surface;
leaving portions of the die pad and terminal lands exposed to the top surface and the bottom surface; and
providing an acoustic opening configured to permit through-air sound transmission through one or both of the molding material and the die pad, the acoustic opening extending between the top surface and the bottom surface.
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Accused Products
Abstract
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic port, such that the package can be soldered on a back side of a printed circuit board and have air access to a sensor die in the package from a front side of the printed circuit board via the acoustic port. The leadframe may also have a hollow or concave recess that defines an acoustic cavity in conjunction with the sensor die or printed circuit board.
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Citations
19 Claims
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1. A method of manufacturing a pre-molded leadframe for use in a cavity semiconductor package, the method comprising:
providing a die pad and a plurality of terminal lands;
providing one or more tie bars extending between the die pad and an outer frame portion;
molding a material about the die pad and the terminal lands to form a substrate having the outer frame portion, a top surface and a bottom surface;
leaving portions of the die pad and terminal lands exposed to the top surface and the bottom surface; and
providing an acoustic opening configured to permit through-air sound transmission through one or both of the molding material and the die pad, the acoustic opening extending between the top surface and the bottom surface.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a pre-molded leadframe substrate, the method comprising:
- positioning a die pad and a plurality of terminal lands in a substantially common plane within a mold so as to define one or more interstitial volumes among the die pad and terminal lands;
flowing a material into at least one of the one or more interstitial volumes, wherein the material, die pad and terminal lands define a substantially planar substrate having a top surface and a bottom surface; and
forming an acoustic opening extending between the top surface and the bottom surface for through-air transmission of sound through one or both of the mold and die pad, wherein, subsequent to the act of flowing the material, at least a portion of the die pad and a portion of one or more of the terminal lands are exposed to one or both of the top surface and the bottom surface and free of the material. - View Dependent Claims (16, 17)
- positioning a die pad and a plurality of terminal lands in a substantially common plane within a mold so as to define one or more interstitial volumes among the die pad and terminal lands;
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18. A method of assembling a cavity semiconductor package, the method comprising:
- providing a pre-molded leadframe substrate comprising a top surface and a bottom surface, a die pad and a plurality of exposed terminal lands arranged in a substantially common plane between the top surface and the bottom surface, and a molding material, wherein the pre-molded leadframe substrate defines an acoustic opening for through-air transmission of acoustic energy through one or both of the molding material and die pad, the acoustic opening extending between the top surface and the bottom surface;
coupling a semiconductor die being responsive to through-air transmission of acoustic energy to the pre-molded leadframe substrate, wherein said act of coupling comprises positioning the semiconductor die so as to receive at least a portion of any through-air transmission of acoustic energy passing through the acoustic opening. - View Dependent Claims (19)
- providing a pre-molded leadframe substrate comprising a top surface and a bottom surface, a die pad and a plurality of exposed terminal lands arranged in a substantially common plane between the top surface and the bottom surface, and a molding material, wherein the pre-molded leadframe substrate defines an acoustic opening for through-air transmission of acoustic energy through one or both of the molding material and die pad, the acoustic opening extending between the top surface and the bottom surface;
Specification