Lithographic apparatus and device manufacturing method

• US 7,795,603 B2
• Filed: 12/19/2008
• Issued: 09/14/2010
• Est. Priority Date: 11/12/2002
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Meijer, Hendricus Johannes Maria, Mulkens, Johannes Catharinus Hubertus, De Smit, Joannes Theodoor, Loopstra, Erik Roelof, Lof, Joeri, Ritsema, Roelof Aeilko Siebrand, Simon, Klaus, Modderman, Theodorus Marinus
• Primary Examiner(s): Pyo; Kevin
• Assistant Examiner(s): WILLIAMS, DON J
• Application Number:
  US12/318,036
• Publication Number:
  US 20090184270A1
• Time in Patent Office: 634 Days
• Field of Search: 250/548, 250/559.29, 250/559.2, 250/559.21, 250/559.32, 250/559.3, 250/559.28, 2504911-4912, 250/492.22, 355/30, 355/53, 355/55, 355/56, 355/67, 355 71- 75, 359/358, 359/642, 359/649, 359/656, 359/665
• US Class Current: 250/548
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/7085 Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7034 Leveling
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

A map of the surface of a substrate is generated at a measurement station. The substrate is then moved to where a space between a projection lens and the substrate is filled with a liquid. The substrate is then aligned using, for example, a transmission image sensor and, using the previous mapping, the substrate can be accurately exposed. Thus the mapping does not take place in a liquid environment.

Claims

1. A method of patterning a substrate, the method comprising:

measuring at a measurement station a height, a tilt, or both, of each of a plurality of points on the substrate, wherein the measuring is not performed through liquid adjacent to the substrate;

moving the substrate from the measurement station to an exposure station;

providing a liquid at the exposure station in a space between a projection system and the substrate;

moving one or more of the plurality of points to a focal point of the projection system based on the measuring; and

projecting a patterned beam through the liquid onto a target portion of the substrate.

2. The method of claim 1, further comprising measuring the substrate at the measurement station at least partially overlapping in time with exposure of a further substrate at the exposure station.

3. The method of claim 1, further comprising:

detecting a reference on a substrate table configured to hold the substrate;

measuring a location of the reference and the location of each of a plurality of alignment points on the substrate; and

determining the location of each of the plurality of alignment points on the substrate relative to the reference on the substrate table.

4. The method of claim 3, wherein measuring the location of the reference is not performed through liquid adjacent to the substrate table.

5. The method of claim 3, further comprising:

measuring a location of the reference at the exposure station; and

applying a correction to the measuring of the location of the reference to account for the liquid between the projection system and the substrate.

6. The method of claim 1, further comprising applying a correction to the measuring not performed through liquid to account for the absence of liquid.

7. The method of claim 1, further comprising generating a map of the substrate based on the measuring, and moving one or more of the plurality of points to a focal point of the projection system based on the map of the substrate.

8. The method of claim 1, further comprising measuring at a measurement station a location of each of a plurality of alignment points on the substrate, wherein the measuring of the location is not performed through liquid adjacent to the substrate, and moving the substrate at the exposure station based on the measuring of the location of each of the plurality of alignment points on the substrate.

9. The method of claim 1, wherein the measurement station is physically separated from the exposure station.

10. A method of patterning a substrate, the method comprising:

measuring at a measurement station a height, a tilt, or both, of each of a plurality of points on a first substrate, wherein the measuring is not performed through liquid adjacent to the substrate;

moving the first substrate from the measurement station to an exposure station physically separated from the measurement station;

providing a liquid at the exposure station in a space between a projection system and the first substrate;

moving one or more of the plurality of points of the first substrate to a focal point of the projection system based on the measuring;

projecting a patterned beam through the liquid onto a target portion of the first substrate; and

measuring a second substrate at the measurement station at least partially overlapping in time with exposure of the first substrate at the exposure station.

11. The method of claim 10, further comprising:

detecting a reference on a substrate table configured to hold the first substrate;

measuring a location of the reference and the location of each of a plurality of alignment points on the first substrate; and

determining the location of each of the plurality of alignment points on the first substrate relative to the reference on the substrate table.

12. The method of claim 11, wherein measuring the location of the reference is not performed through liquid adjacent to the substrate table.

13. The method of claim 11, further comprising:

measuring a location of the reference at the exposure station; and

applying a correction to the measuring of the location of the reference to account for the liquid between the projection system and the first substrate.

14. The method of claim 10, further comprising applying a correction to the measuring not made through liquid to account for the absence of liquid.

15. The method of claim 10, further comprising generating a map of the first substrate based on the measuring, and moving one or more of the plurality of points to a focal point of the projection system based on the map of the first substrate.

16. The method of claim 10, further comprising measuring at a measurement station a location of each of a plurality of alignment points on the first substrate, wherein the measuring of the location is not performed through liquid adjacent to the first substrate, and moving the first substrate at the exposure station based on the measuring of the location of each of the plurality of alignment points on the first substrate.

17. The method of claim 10, comprising applying a correction to the measuring not performed through liquid to account for liquid in the space between the projection system and the first substrate.

18. A method of patterning a substrate, the method comprising:

measuring at a measurement station a height, a tilt, or both, of each of a plurality of points on the substrate, wherein the measuring is not performed through liquid adjacent to the substrate;

applying a correction to the measuring to account for the absence of liquid adjacent to the substrate;

moving the substrate from the measurement station to an exposure station;

providing a liquid at the exposure station in a space between a projection system and the substrate;

moving one or more of the plurality of points to a focal point of the projection system based on the measuring; and

projecting a patterned beam through the liquid onto a target portion of the substrate.