Semiconductor device with oxidized regions and method for fabricating the same
First Claim
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1. A semiconductor device comprising:
- an active layer made of a first group III-nitride semiconductor layer formed on a substrate,crystal defects existing in the active layer, andoxidized layers formed on the active layer,wherein the oxidized layers are located separately from each other, each of the oxidized layers being formed selectively around each of the crystal defects, anda vertical size of each of the oxidized layers has a local maximum value at each of the crystal defects,wherein the local maximum value occurs only at one position of each of the oxidized layers, andthe oxidized layers penetrate the active layer.
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Abstract
A semiconductor device, which includes an active layer made of a first semiconductor layer formed on a substrate, is designed so that a first oxidized area made of an oxide layer is formed on the active layer. The first oxidized area further aids in reducing a reactive current so that it becomes possible to achieve a semiconductor device having superior device characteristics.
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Citations
5 Claims
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1. A semiconductor device comprising:
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an active layer made of a first group III-nitride semiconductor layer formed on a substrate, crystal defects existing in the active layer, and oxidized layers formed on the active layer, wherein the oxidized layers are located separately from each other, each of the oxidized layers being formed selectively around each of the crystal defects, and a vertical size of each of the oxidized layers has a local maximum value at each of the crystal defects, wherein the local maximum value occurs only at one position of each of the oxidized layers, and the oxidized layers penetrate the active layer. - View Dependent Claims (2, 3, 4, 5)
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Specification