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Low cost millimeter wave imager

  • US 7,795,859 B1
  • Filed: 07/15/2009
  • Issued: 09/14/2010
  • Est. Priority Date: 12/16/2005
  • Status: Active Grant
First Claim
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1. An RF printed circuit board comprising:

  • a substrate having a thickness of one quarter wavelength of a millimeter wave;

    a first metal pattern on a first side of the substrate, the first metal pattern comprising bonding pads;

    a second metal pattern comprising electrical connections for readout electronics on a second side of the substrate, the second side facing oppositely away from the first side;

    a plurality of vias through the substrate for routing a signal from the first side to the electrical connections for readout electronics located on the second side; and

    a flip chip comprising backward tunneling diode detectors, the flip chip bonded to the bonding pads on the first side of the substrate.

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