Low cost millimeter wave imager
First Claim
1. An RF printed circuit board comprising:
- a substrate having a thickness of one quarter wavelength of a millimeter wave;
a first metal pattern on a first side of the substrate, the first metal pattern comprising bonding pads;
a second metal pattern comprising electrical connections for readout electronics on a second side of the substrate, the second side facing oppositely away from the first side;
a plurality of vias through the substrate for routing a signal from the first side to the electrical connections for readout electronics located on the second side; and
a flip chip comprising backward tunneling diode detectors, the flip chip bonded to the bonding pads on the first side of the substrate.
1 Assignment
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Accused Products
Abstract
Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.
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Citations
13 Claims
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1. An RF printed circuit board comprising:
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a substrate having a thickness of one quarter wavelength of a millimeter wave; a first metal pattern on a first side of the substrate, the first metal pattern comprising bonding pads; a second metal pattern comprising electrical connections for readout electronics on a second side of the substrate, the second side facing oppositely away from the first side; a plurality of vias through the substrate for routing a signal from the first side to the electrical connections for readout electronics located on the second side; and a flip chip comprising backward tunneling diode detectors, the flip chip bonded to the bonding pads on the first side of the substrate. - View Dependent Claims (2, 3, 4, 5)
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6. An RF printed circuit board comprising:
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a substrate having a thickness of one quarter wavelength of a millimeter wave; a first metal pattern on a first side of the substrate, the metal pattern comprising bonding pads; a second metal pattern comprising electrical connections for readout electronics on a second side of the substrate, the second side facing oppositely away from the first side; a plurality of vias through the substrate for routing a signal from the first side to the electrical connections for readout electronics located on the second side; a flip chip comprising backward tunneling diode detectors, the flip chip bonded to the bonding pads on the first side of the substrate; a two-dimensional array of horn antennas electrically coupled to the substrate; and a plurality of readout electronics located on the second side of the substrate, wherein the two-dimensional array of horn antennas is a single block, and wherein the electrical coupling between the two-dimensional array of horn antennas and the RF printed circuit board is either by direct bonding or through radiative coupling.
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7. A printed circuit board for detecting RF wave energy comprising:
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means for detecting wave energy on a first side of the printed circuit board; means for receiving and directing the wave energy radiatively toward the means for detecting wave energy without an intervening active component; and means for providing the detected wave energy to readout circuitry on a second side of the printed circuit board, the second side facing oppositely away from the first side. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification