LED housing

• US 7,796,030 B2
• Filed: 05/28/2008
• Issued: 09/14/2010
• Est. Priority Date: 12/29/2005
• Status: Active Grant

• Current Assignee: Lam Chiang Lim
• Original Assignee: Lam Chiang Lim
• Inventors: Lim, Lam Chiang
• Primary Examiner(s): Zimmerman; Brian A
• Assistant Examiner(s): SAMSON, SARA B
• Application Number:
  US12/154,930
• Publication Number:
  US 20080309504A1
• Time in Patent Office: 839 Days
• Field of Search: 340/500, 340/540, 362/646, 362/650, 362/800, 362/555, 362/120, 257/712, 257/718, 257/721, 257/722, 361/701
• US Class Current: 340/540
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A high power LED Housing consisting of one or more LED to form a LED assembly fitted into a metal body having an upper portion with a gripping means and a lower portion with a fitting means and a base. The LED assembly is connected by electrical wire to a base of the metal body, the base of the metal body having an electrical contact.

By means of the gripping means, the LED housing can be installed or removed from a socket shaped to receive the LED housing.

The LED housing can be assembled into panels of LED housing which can be fitted with electrical and electronic circuits to monitor and control the operation of the LED housing for various applications.

Claims

1. A circuit board for a high power LED housing comprising:

one or more LED forming a LED assembly;

a metal body;

said metal body having a top, an upper portion having gripping means, a lower portion and a base;

said LED assembly mounted within the said metal body, and a lens fitted onto said top of said metal body, said lower portion having fitting means on its exterior;

said LED assembly connected by electrical wire to an electrical contact in said metal body;

wherein said LED housing is adapted to be installed on a metal plate acting as a heat sink having a socket by fitting said LED housing into said socket in said heat sink, said socket shaped to receive said lower portion of said LED housing and said LED-housing being removable from said heat sink by unfitting it from said socket;

and in which said LED assembly is connected by said electrical wire to said electrical contact at the base of said metal body, and said electrical contact includes a circuit board comprising a voltage regulator, current control circuit, monitoring and feedback circuit and temperature sensor, and when installed into said heat sink, said LED assembly is connected thereto to an electrical power source so that performance of the LED assembly can be monitored from a remote maintenance center and if the LED assembly fails, its failure can be transmitted to said remote maintenance center for maintenance action.

2. A circuit board for a high power LED housing as claimed in claim 1 in which said circuit board further comprises a motion sensor and a resistor so that if there is no movement, the high power LED housing will be partially bright and if said motion sensor detects the presence of movement of surrounding objects, said motion sensor will activate the circuit board to fully turn on said high power LED housing and upon the cessation of movement, said high power LED housing will once again be partially bright.

3. A circuit board for a high power LED housing as claimed in claim 2 in which said circuit board further comprises a microcontroller and a communication link so that when installed into said heat sink, said LED assembly is connected thereto to an electrical power source and if there is no movement, the high power LED housing will be partially bright and when the motion sensor detects the presence of movement of surrounding objects, said motion sensor will activate said circuit board to turn on said high power LED housing and at the same time, said microcontroller activates said communications link to send a signal to the adjacent forward high power LED housing to brighten up, in accordance with predetermined algorithms so that the LED housing ahead of the moving object gradually brightens while those LED housings behind the moving object gradually return to their partial brightness state.

4. A circuit board for a high power LED housing as claimed in claim 2 in which said circuit board further comprises an infrared detector, a resistor, a microcontroller and a communication link so that when installed into said heat sink, said LED assembly is connected thereto to an electrical power source and if there is no movement, said high power LED housing will be partially bright and when said infrared detector senses the presence of heat in surrounding objects, said infrared detector will activate said circuit board to turn on the high power LED housing and at the same time, said microcontroller will activate said communications link to send a signal to the adjacent forward high power LED housing to brighten up, in accordance with predetermined algorithms so that said LED housing ahead of the moving object gradually brightens while those LED housings behind the moving object gradually return to their partial brightness state.

5. A circuit board for a high power LED housing as claimed in claim 3 wherein said communication link is RF wireless or Infrared or Power Supply line communication or is said High Power LED light beam itself.