Liquid crystal display panel and fabricating method thereof

• US 7,796,227 B2
• Filed: 10/28/2005
• Issued: 09/14/2010
• Est. Priority Date: 12/23/2004
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Park, Jong Woo
• Primary Examiner(s): Nelms; David
• Assistant Examiner(s): Chien; Lucy P
• Application Number:
  US11/260,287
• Publication Number:
  US 20060139554A1
• Time in Patent Office: 1,782 Days
• Field of Search: None
• US Class Current: 349/149
• CPC Class Codes: G02F 1/1341 Filling or closing of cells
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13458 Terminal pads
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer

Abstract

This invention relates to a liquid crystal display panel adapted to prevent corrosion of a pad electrode and reduce a liquid crystal margin area, and a fabricating method thereof. A liquid crystal display panel includes first and second substrates bonded with a sealant; a signal line on the first substrate; a pad formed on a different plane than the signal line; and a contact part overlapping the sealant and connecting the signal line to the pad.

Claims

1. A liquid crystal display panel, comprising:

first and second substrates bonded with a sealant;

a signal line on the first substrate;

a pad formed on a different plane than the signal line; and

a contact part overlapping the sealant and connecting the signal line to the pad,

wherein the contact part includes;

a single contact hole exposing both of the end of each of the data line and the data pad lower electrode; and

a contact electrode connecting the data line and data pad lower electrode that are exposed through the contact hole,

wherein all the contact hole overlaps the sealant,

wherein the signal line is at least one of a data line and a gate line and the pad is at least one of a data pad and a gate pad,

wherein the data pad and a gate pad are located in parallel, and

wherein a gate link between the gate line and the gate pad, and a data link between the data line and the data pad are formed in a crossing structure, the crossing part of the gate link and the data link overlaps the sealant.

2. The liquid crystal display panel according to claim 1, wherein the data pad includes:

a data pad lower electrode formed on a different plane from a data line;

a contact hole penetrating an insulating film to expose the data pad lower electrode; and

a data pad upper electrode connected to the data pad lower electrode through the contact hole.

3. The liquid crystal display panel according to claim 2, wherein the data pad lower electrode is formed of a same metal on a same plane as a gate line.

4. The liquid crystal display panel according to claim 2, wherein the gate pad includes:

a gate pad lower electrode extending from a gate line;

a second contact hole penetrating the insulating film to expose the gate pad lower electrode; and

a gate pad upper electrode connected to the gate pad lower electrode through the second contact hole.

5. The liquid crystal display panel according to claim 1, wherein the first substrate is a thin film transistor substrate and the second substrate is a color filter substrate.

6. The liquid crystal display panel according to claim 5, wherein the thin film transistor substrate includes:

a gate line and a data line crossing each other;

a thin film transistor formed at a crossing thereof; and

a pixel electrode connected to the thin film transistor and formed in part in a contact hole, wherein the thin film transistor includes a gate insulating film between a gate electrode and an active layer, forming a channel between a source electrode and a drain electrode.

7. A method of fabricating a liquid crystal display panel, comprising:

forming a signal line on a first substrate;

forming a pad on a different plane than the signal line;

forming a contact part connecting the signal line to the pad; and

forming a sealant bonding the first substrate and a second substrate in an area, the contact part overlapping the sealant in the area,

wherein forming the contact part includes;

forming a single contact hole exposing both of an end of each of the data line and the data pad lower electrode; and

forming a contact electrode connecting the data line and data pad lower electrode that are exposed through the contact hole,

wherein all the contact hole overlaps the sealant

wherein the signal line is at least one of a data line and a gate line and the pad is at least one of a data pad and a gate pad,

wherein the data pad and a gate pad are located in parallel, and

wherein a gate link between the gate line and the gate pad, and a data link between the data line and the data pad are formed in a crossing structure, the crossing part of the gate link and the data link overlap the sealant.

8. The method according to claim 7, wherein forming the pad includes:

forming a data pad lower electrode on a different plane than a data line;

forming a contact hole penetrating an insulating film to expose the data pad lower electrode; and

forming a data pad upper electrode connected to the data pad lower electrode through the contact hole.

9. The method according to claim 8, further comprising:

forming a gate pad lower electrode extended from a gate line;

forming a second contact hole penetrating the insulating film to expose the gate pad lower electrode; and

forming a gate pad upper electrode connected to the gate pad lower electrode through the second contact hole.