Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
First Claim
1. A computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection, comprising:
- acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer;
combining the output for the centrally located die and the one or more dies based on within die positions of the output, wherein the output comprises gray levels, and wherein said combining comprises determining a mean value and a median value of the gray levels across the within die positions; and
generating the standard reference die based on results of said combining, wherein the standard reference die comprises the mean value across the within die positions, and wherein the method further comprises generating an additional standard reference die of the median value across the within die positions.
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Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
339 Citations
28 Claims
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1. A computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection, comprising:
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acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer; combining the output for the centrally located die and the one or more dies based on within die positions of the output, wherein the output comprises gray levels, and wherein said combining comprises determining a mean value and a median value of the gray levels across the within die positions; and generating the standard reference die based on results of said combining, wherein the standard reference die comprises the mean value across the within die positions, and wherein the method further comprises generating an additional standard reference die of the median value across the within die positions. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for inspecting a wafer, comprising:
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acquiring output of an inspection system for the wafer; combining the output for a centrally located die on the wafer and one or more dies located on the wafer based on within die positions of the output, wherein the output comprises gray levels, and wherein said combining comprises determining a mean value and a median value of the gray levels across the within die positions; generating a standard reference die based on results of said combining, wherein the standard reference die comprises the mean value across the within die positions, and wherein the method comprises generating an additional standard reference die of the median value across the within die positions; and comparing the standard reference die to the output for one or more test dies on the wafer to detect defects in the one or more test dies. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for inspecting a wafer, comprising:
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acquiring output of an inspection system for a standard reference wafer; combining the output for a centrally located die on the standard reference wafer and one or more dies located on the standard reference wafer based on within die positions of the output, wherein the output comprises gray levels, and wherein said combining comprises determining a mean value and a median value of the gray levels across the within die positions; generating a standard reference die based on results of said combining, wherein the standard reference die comprises the mean value across the within die positions, and wherein the method comprises generating an additional standard reference die of the median value across the within die positions; acquiring output of the inspection system for the wafer; and comparing the standard reference die to output for one or more test dies on the wafer to detect defects in the one or more test dies. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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Specification