Defect probability calculating method and semiconductor device manufacturing method
First Claim
1. A defect probability calculating method comprising:
- assuming a plurality of process conditions containing process variations caused in a process of forming a pattern on a substrate based on a design pattern;
acquiring appearance probabilities of the respective process conditions;
performing process simulation to predict a pattern to be formed on a substrate based on the design pattern for each of the process conditions;
determining whether the pattern predicted by performing the process simulation satisfies preset criteria for each of the process conditions; and
acquiring first probability by adding together appearance probabilities of the process conditions used for process simulation of patterns which are determined not to satisfy the preset criteria.
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Abstract
A defect probability calculating method includes assuming a plurality of process conditions containing process variations caused in a process of forming a pattern on a substrate based on a design pattern, acquiring appearance probabilities of the respective process conditions, performing process simulation to predict a pattern to be formed on a substrate based on the design pattern for each of the process conditions, determining whether the pattern predicted by performing the process simulation satisfies preset criteria for each of the process conditions, and acquiring first probability by adding together appearance probabilities of the process conditions used for process simulation of patterns which are determined not to satisfy the preset criteria.
21 Citations
17 Claims
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1. A defect probability calculating method comprising:
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assuming a plurality of process conditions containing process variations caused in a process of forming a pattern on a substrate based on a design pattern; acquiring appearance probabilities of the respective process conditions; performing process simulation to predict a pattern to be formed on a substrate based on the design pattern for each of the process conditions; determining whether the pattern predicted by performing the process simulation satisfies preset criteria for each of the process conditions; and acquiring first probability by adding together appearance probabilities of the process conditions used for process simulation of patterns which are determined not to satisfy the preset criteria. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A defect probability calculating method comprising:
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dividing process variations occurring in a process of forming a pattern on a substrate based on a design pattern into a first process variation in which a central value of pattern dimensions shifts and a second process variation in which a pattern dimension varies depending on a pattern arrangement position; assuming a plurality of process conditions containing the first process variations; acquiring appearance probabilities of the respective process conditions; performing process simulation for each of the process conditions with respect to the design pattern to predict a preset pattern; acquiring a ratio at which the preset pattern predicted for each of the process conditions does not satisfy a preset dimensional condition due to the second process variation; acquiring a product of the appearance probability and the ratio for each of the process conditions; and acquiring first probability by adding together the products acquired for the respective process conditions. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification