Pressure sensor module and method for manufacturing the same
First Claim
1. A pressure sensor module comprising a printed circuit board (1) and a pressure cell (4), wherein the pressure cell (4) has a measuring opening (6) and the pressure cell (4) is encapsulated with injection molding compound (8) in such a manner that the measuring opening (6) of the pressure cell (4) is left open,wherein the pressure cell (4), as viewed from the measuring direction (11), is attached on the rear side of the printed circuit board (1),wherein the printed circuit board (1) has a recess (7) in the area of the measuring opening (6), andwherein the injection molding compound (8) encloses the attachment area (10) of the pressure cell (4) on the printed circuit board (1).
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Accused Products
Abstract
For a pressure sensor module comprising a printed circuit board and a pressure cell, wherein the pressure cell has a measuring opening, and the pressure cell is encapsulated by injection molding compound in such a manner that the measuring opening is kept open, the pressure cell, as viewed from the measuring opening, is attached on the rear side of the printed circuit board. The printed circuit board has a recess in the area of the measuring opening, and the injection molding compound encloses the attachment area of the pressure cell on the printed circuit board. Thereby, the use of different adhesives, also soft adhesives, for the connection of the pressure cell with the printed circuit board is possible without this attachment area being attacked by the surrounding media.
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Citations
9 Claims
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1. A pressure sensor module comprising a printed circuit board (1) and a pressure cell (4), wherein the pressure cell (4) has a measuring opening (6) and the pressure cell (4) is encapsulated with injection molding compound (8) in such a manner that the measuring opening (6) of the pressure cell (4) is left open,
wherein the pressure cell (4), as viewed from the measuring direction (11), is attached on the rear side of the printed circuit board (1), wherein the printed circuit board (1) has a recess (7) in the area of the measuring opening (6), and wherein the injection molding compound (8) encloses the attachment area (10) of the pressure cell (4) on the printed circuit board (1).
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7. A pressure sensor module comprising a printed circuit board (1) and a pressure cell (4), wherein the pressure cell (4) has a measuring opening (6) and the pressure cell (4) is encapsulated with injection molding compound (8) in such a manner that the measuring opening (6) of the pressure cell (4) is left open,
wherein the pressure cell (4), as viewed from the measuring direction (11), is attached on the rear side of the printed circuit board (1), wherein the printed circuit board (1) has a recess (7) in the area of the pressure cell (4), the diameter of which recess is at least double the size of the diameter of the measuring opening (6) of the pressure cell (4), and wherein the injection molding compound (8) encloses the attachment area (10) of the pressure cell (4) on the printed circuit board (1).
Specification