Integrated circuit interconnects with coaxial conductors
First Claim
1. An integrated circuit interconnect structure, the structure comprising:
- a first conductor of an interconnect;
a second conductor of an interconnect;
a first layer of suspension material that defines a first gap in a region disposed below the first layer of suspension material; and
a second layer of suspension material stacked on the first layer of suspension material, the second layer of suspension material defining a second gap stacked above the first gap, andwherein the second gap is enclosed by the second layer of suspension material and the first layer of suspension material; and
wherein the first conductor and the second conductor are contained within at least one of the first gap and the second gap and are spaced apart from each other in the first gap or the second gap.
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Accused Products
Abstract
High performance interconnect devices, structures, and fabrication methods are provided herein. According to some embodiments of the present invention, an interconnect device used to connect components or route signals in an integrated circuit can comprise multiple conductors. A first conductor of the interconnect device can define a first conductor axis, and a second conductor of the interconnect device can define a second conductor axis. The second conductor can be proximate the first conduct such that first conductor axis is substantially coaxially situated relative to the second conductor axis to provide a high performance interconnect having a coaxial alignment. The first conductor and the second conductor can define a gap disposed between and separating the conductors. Other embodiments are also claimed and described.
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Citations
15 Claims
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1. An integrated circuit interconnect structure, the structure comprising:
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a first conductor of an interconnect; a second conductor of an interconnect; a first layer of suspension material that defines a first gap in a region disposed below the first layer of suspension material; and a second layer of suspension material stacked on the first layer of suspension material, the second layer of suspension material defining a second gap stacked above the first gap, and wherein the second gap is enclosed by the second layer of suspension material and the first layer of suspension material; and wherein the first conductor and the second conductor are contained within at least one of the first gap and the second gap and are spaced apart from each other in the first gap or the second gap. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit interconnect structure, the structure comprising:
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a first layer of suspension material placed on a substrate, the first layer of suspension material defining a first gap between an underside of the first layer of suspension material and the substrate; a second layer of suspension material stacked on the first layer of suspension material, the second layer of suspension material defining a second gap disposed between an underside of the second layer of suspension material and a topside of the first layer of suspension material; and
wherein the second gap is enclosed by the second layer of suspension material and the first layer of suspension material; anda pair of independent, spaced apart conductors disposed on at least one of the top side of the first layer of suspension material in the second gap such the spaced apart conductors are co-located in the second gap or in the first gap below the first layer of suspension material such that the spaced apart conductors are co-located in the first nap. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit interconnect structure, the structure comprising:
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a first conductor of an interconnect spaced apart from a second conductor of an interconnect, the first conductor and the second conductor having different electrical potential such that the conductors are independent conductors; and a layer of suspension material arranged to segment a gap region of the interconnect into an upper gap region and a lower gap region, wherein the upper gap region is disposed to be stacked on the lower gap region, and wherein the upper gap region defines a first enclosed volume that is enclosed off from the lower gap region by the layer of suspension material and the lower gap region defines a second enclosed volume that is enclosed off from the upper gap region by the layer of suspension material, and wherein the first conductor and the second conductor are co-located and disposed in at least one of the upper gap region and the lower gap region. - View Dependent Claims (12, 13, 14, 15)
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Specification