Printable semiconductor structures and related methods of making and assembling
First Claim
1. A method for fabricating a printable semiconductor element, said method comprising the steps of:
- providing a silicon wafer having a (111) orientation and having an external surface;
generating a plurality of recessed features on said external surface of said silicon wafer, wherein each of said recessed features comprises a bottom surface and side surfaces of exposed silicon wafer;
masking at least a portion of said side surfaces of said recessed features; and
etching between said recessed features, wherein etching occurs along <
110>
directions of said silicon wafer, thereby fabricating said printable semiconductor element.
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Accused Products
Abstract
The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
462 Citations
41 Claims
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1. A method for fabricating a printable semiconductor element, said method comprising the steps of:
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providing a silicon wafer having a (111) orientation and having an external surface; generating a plurality of recessed features on said external surface of said silicon wafer, wherein each of said recessed features comprises a bottom surface and side surfaces of exposed silicon wafer; masking at least a portion of said side surfaces of said recessed features; and etching between said recessed features, wherein etching occurs along <
110>
directions of said silicon wafer, thereby fabricating said printable semiconductor element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method for fabricating a printable semiconductor element, said method comprising the steps of:
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providing a silicon wafer having a (111) orientation and having an external surface; generating a plurality of recessed features on said external surface of said silicon wafer, wherein each of said recessed features comprises a bottom surface and side surfaces of exposed silicon wafer, wherein said recessed features comprise first and second channels separated from each other; masking at least a portion of said side surfaces of said first and second channels; and etching between said first and second channels, wherein etching occurs along <
110>
directions of said silicon wafer and proceeds from said first channel to said second channel along the <
110>
directions of said silicon wafer, thereby undercutting at least a portion of said printable semiconductor element between said first and second channels, thereby fabricating said printable semiconductor element. - View Dependent Claims (32, 33, 34)
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35. A method for fabricating a printable semiconductor element, said method comprising the steps of:
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providing a silicon wafer having a (111) orientation and having an external surface; generating a plurality of recessed features on said external surface of said silicon wafer, wherein each of said recessed features comprises a bottom surface and side surfaces of exposed silicon wafer; masking at least a portion of said side surfaces of said recessed features; etching between said recessed features, wherein etching occurs along <
110>
directions of said silicon wafer, thereby fabricating said printable semiconductor element; andreleasing said printable semiconductor element from said silicon wafer by contacting said printable semiconductor element with an elastomeric stamp. - View Dependent Claims (36, 37, 38, 39, 40, 41)
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Specification