Power supply cooling apparatus and configuration

• US 7,800,901 B2
• Filed: 12/21/2006
• Issued: 09/21/2010
• Est. Priority Date: 09/13/2006
• Status: Active Grant

• Current Assignee: Hypertherm Incorporated
• Original Assignee: Hypertherm Incorporated
• Inventors: Kornprobst, Michael F., Borowy, Dennis M., Morris, Ronald E.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/614,543
• Publication Number:
  US 20080061048A1
• Time in Patent Office: 1,370 Days
• Field of Search: None
• US Class Current: 361/690
• CPC Class Codes: B23K 9/10 Other electric circuits therefor; Protective circuits; Remote controls
• CPC Class Codes: B23K 9/32 Accessories earthing connections H01R

Abstract

An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.

Claims

1. A power supply of a welding or plasma cutting system, comprising:

a panel positioned in a center location of the power supply, the panel approximately bisecting the power supply relative to a vertical axis extending therethrough;

a heat sink positioned within the power supply and mounted to the panel, the panel and heat sink together forming a mounting structure;

a first plurality of components connected to the mounting structure;

a power supply enclosure surrounding the mounting structure and comprising a wall;

a thermally-conductive plate having a first surface and a second surface opposed to the first surface; and

a plurality of heat-generating components mounted on the first surface of the plate,

wherein the plate is disposed between the plurality of heat-generating components and the wall of the power supply enclosure, the plate being disposed to maintain a gap between the second surface and the wall, the gap facilitating a gas flow around an exposed surface area of the plate.

2. The power supply of claim 1, wherein the first plurality of components includes at least one of a carrying handle for the power supply, an inductor, a transformer, an electromagnet, a resistor, a silicon power device, or a magnetic device.

3. The power supply of claim 1, wherein the enclosure includes at least two end panels, a base, and a cover.

4. The power supply of claim 1, wherein the plurality of heat-generating components includes at least one of the following:

an inductor, a transformer, or an electromagnet.

5. The power supply of claim 1, wherein the plurality of heat-generating components includes a thermally-conductive electrical polymer.

6. The power supply of claim 1, wherein the gas flow is an airflow.

7. The power supply of claim 1, wherein the plate is connected to the panel.

8. The power supply of claim 1, wherein an edge located about a periphery of the plate is connected to the wall.

9. The power supply of claim 1, wherein the plurality of heat-generating components further comprises an electromagnetic component including:

a core having a length with a first end and a second end; and

a plurality of windings disposed around the core,

wherein the first end includes a surface adapted to engage a surface of the heat sink, the core being thermally connected to the heat sink.

10. The power supply of claim 9, wherein the electromagnetic component comprises at least one of the following:

an inductor, a transformer, or an electromagnet.

11. The power supply of claim 9, wherein the electromagnetic component comprises a thermally-conductive electrical polymer.

12. The power supply of claim 9, wherein the first end is formed to have a planar surface that engages a mating planar surface of the heat sink.

13. The power supply of claim 9, wherein the electromagnetic component abuts at least a portion of a circuit board, the electromagnetic component electrically connected to the circuit board.

14. A method of assembling a power supply of a welding or plasma cutting system, comprising:

positioning a panel at a central location within the power supply, the panel at least substantially bisecting the power supply relative to a vertical axis extending therethrough;

mounting a heat sink to the panel, the panel and heat sink together forming a mounting structure;

connecting a first plurality of components to the mounting structure;

connecting a power supply enclosure having a wall to the mounting structure,

positioning in the power supply a thermally-conductive plate having a first surface and a second surface opposed to the first surface; and

mounting a plurality of heat-generating components on the first surface of the plate,

wherein the plate is disposed between the plurality of heat-generating components and the wall of the power supply enclosure, the plate being positioned to maintain a gap between the second surface and the wall, the gap facilitating a gas flow around an exposed surface area of the plate.