Cooling apparatus having low profile extrusion and method of manufacture therefor

• US 7,802,436 B2
• Filed: 01/20/2006
• Issued: 09/28/2010
• Est. Priority Date: 06/08/1998
• Status: Expired due to Fees

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: DeVilbiss, Roger S., Parish, Overton L. IV
• Primary Examiner(s): Ali; Mohammad M
• Application Number:
  US11/336,698
• Publication Number:
  US 20060137181A1
• Time in Patent Office: 1,712 Days
• Field of Search: 62/32, 62/33, 62/37, 622/592, 165/80.3, 165/80.4, 165/104.11, 165/104.21, 165/104.26, 165/104.33
• US Class Current: 62/3.7
• CPC Class Codes: F28D 1/0246 heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 1/022 with multiple channels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/49377 Tube with heat transfer means
• CPC Class Codes: Y10T 29/49378 Finned tube
• CPC Class Codes: Y10T 29/49385 Made from unitary workpiece, i.e., no assembly
• CPC Class Codes: Y10T 29/49396 Condenser, evaporator or vaporizer making

Abstract

A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Claims

1. A cooling system for removing heat from at least one heat generating component, said cooling system comprising:

a pump configured to circulate a first heat transfer liquid;

a plurality of flow assemblies in fluid communication with the pump, each of the plurality of flow assemblies having a first interior space disposed therein, a fluid inlet coupled to the first interior space thereof for receiving the first heat transfer liquid therein, and a fluid outlet coupled to the first interior space thereof for removing the first heat transfer liquid therefrom, the fluid inlets and the fluid outlets of each of the plurality of flow assemblies being substantially coplanar therewith;

a plurality of sealed assemblies, each of the sealed assemblies comprising a sealed housing having an evaporator section and a condenser section;

a plurality of thermoelectric coolers, each of the thermoelectric coolers having a first side and a second side;

the plurality of flow assemblies and the plurality of sealed assemblies being juxtaposed together in an alternating sequence, the alternating sequence comprising;

a first flow assembly of the plurality of flow assemblies in thermal contact with a first side of a first thermoelectric cooler of the plurality of thermoelectric coolers;

a first sealed assembly of the plurality of sealed assemblies in thermal contact with a second side of the first thermoelectric cooler and a second side of a second thermoelectric cooler of the plurality of thermoelectric coolers;

a second flow assembly of the plurality of flow assemblies in thermal contact with a first side of the second thermoelectric cooler and a first side of a third thermoelectric cooler of the plurality of thermoelectric coolers; and

a second sealed assembly of the plurality of sealed assemblies in thermal contact with a second side of the third thermoelectric cooler;

wherein at least one of the plurality of sealed assemblies includes a second interior space comprising a plurality of micro tubes and containing a second heat transfer fluid; and

wherein each of the plurality of micro tubes are connected in fluid communication one with the other.

2. The cooling system of claim 1, wherein at least one of the plurality of flow assemblies comprises a low profile extrusion.

3. The cooling system of claim 1, wherein at least one of the plurality of sealed assemblies comprises a low profile heat pipe extrusion.

4. The cooling system of claim 1, wherein at least one of the plurality of thermoelectric coolers removes heat from the first heat transfer liquid of at least one of the plurality of flow assemblies and transfers the removed heat to the evaporator section of at least one of the plurality of sealed assemblies.

5. The cooling system of claim 4, wherein at least one of the plurality of sealed assemblies transfers the removed heat from the evaporator section to the condenser section of the at least one sealed assembly.

6. The cooling system of claim 1, further comprising at least one capillary groove on an interior surface of each of the plurality of micro tubes.

7. The cooling system of claim 1, further comprising a wick structure within each of the plurality of micro tubes to facilitate removal of heat via capillary action.

8. The cooling system of claim 7, wherein the wick structure is selected from the group consisting of internal fins, grooved inner sidewalls, and metal screens.

9. The cooling system of claim 8, wherein at least one of the plurality of sealed assemblies transfers heat from the condenser section to an air flow.

10. A method for removing heat from at least one heat generating component, the method comprising:

providing a pump configured to circulate a first heat transfer liquid;

coupling, to the pump, a plurality of flow assemblies, each of the plurality of flow assemblies having an interior space disposed therein, a fluid inlet coupling the interior space to the pump for receiving a first heat transfer liquid therein, and a fluid outlet coupling the interior space to the pump for removing the first heat transfer liquid therefrom, the fluid inlets and the fluid outlets of each of the plurality of flow assemblies being substantially coplanar therewith;

providing a plurality of sealed assemblies, each of the sealed assemblies comprising a sealed housing having an evaporator section and a condenser section;

providing a plurality of thermoelectric coolers;

forming a stacked array by thermally coupling the plurality of flow assemblies and the plurality of sealed assemblies in an alternating sequence with a thermoelectric cooler of the plurality of thermoelectric coolers disposed between each assembly in the stacked array, the forming the stacked array comprising;

thermally coupling a first flow assembly of the plurality of flow assemblies to a first side of a first thermoelectric cooler of the plurality of thermoelectric coolers;

thermally coupling a first sealed assembly of the plurality of sealed assemblies to a second side of the first thermoelectric cooler and a second side of a second thermoelectric cooler of the plurality of thermoelectric coolers;

thermally coupling a second flow assembly of the plurality of flow assemblies to a first side of the second thermoelectric cooler and a first side of a third thermoelectric cooler of the plurality of thermoelectric coolers; and

thermally coupling a second sealed assembly of the plurality of sealed assemblies in thermal contact to a second side of the third thermoelectric cooler;

removing heat from the first heat transfer liquid of the at least one of the plurality of flow assemblies via at least one of the plurality of thermoelectric coolers;

transferring the removed heat to the evaporator section of at least one of the plurality of sealed assemblies via at least one of the plurality of thermoelectric coolers;

wherein at least one of the plurality of sealed assemblies includes a second interior space comprising a plurality of micro tubes and containing a second heat transfer fluid; and

wherein each of the plurality of micro tubes are connected in fluid communication one with the other.

11. The method of claim 10 further comprising:

transferring the removed heat from the evaporator section to the condenser section of at least one of the plurality of sealed assemblies.

12. The method of claim 11 further comprising:

transferring the removed heat from the condenser section to an air flow.

13. The method of claim 10, wherein at least one of the plurality of flow assemblies comprises a low profile extrusion.

14. The method of claim 10, wherein at least one of the plurality of sealed assemblies comprises a low profile heat pipe extrusion.

15. The method of claim 10, wherein each of the plurality of micro tubes includes at least one capillary groove on an interior surface.

16. The method of claim 10, wherein each of the plurality of micro tubes includes a wick structure to facilitate removal of heat via capillary action.

17. The method of claim 16, wherein the wick structure is selected from the group consisting of internal fins, grooved inner sidewalls, and metal screens.

18. A cooling apparatus for removing heat, said cooling apparatus comprising:

a plurality of thermoelectric coolers each having a first side and a second side;

a plurality of low profile extrusions each having an interior space containing a heat transfer fluid disposed therein, the plurality of low profile extrusions each having an evaporator portion and a condenser portion;

a plurality of flow assemblies each having first and second generally flat surfaces and an interior space disposed therebetween, the plurality of flow assemblies each having a fluid inlet coupled to the interior space thereof for receiving a first heat transfer liquid therein and a fluid outlet coupled to the interior space thereof for removing the first heat transfer liquid therefrom; and

the plurality of low profile extrusions and the plurality of flow assemblies being stacked in an alternating sequence to form an array with a thermoelectric cooler of the plurality of thermoelectric coolers being interposed between each assembly of the array, the array comprising;

a first flow assembly of the plurality of flow assemblies in thermal contact with a first side of a first thermoelectric cooler of the plurality of thermoelectric coolers;

a first sealed assembly of the plurality of sealed assemblies in thermal contact with a second side of the first thermoelectric cooler and a second side of a second thermoelectric cooler of the plurality of thermoelectric coolers;

a second flow assembly of the plurality of flow assemblies in thermal contact with a first side of the second thermoelectric cooler and a first side of a third thermoelectric cooler of the plurality of thermoelectric coolers; and

a second sealed assembly of the plurality of sealed assemblies in thermal contact with a second side of the third thermoelectric cooler.