High-pressure sensor device and method for manufacturing same
First Claim
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1. A high-pressure sensor device, comprising:
- a pressure sensor element including a membrane deformable under pressure and a functional layer mechanically coupled to the membrane, wherein the functional layer includes at least one electric terminal area and the functional layer undergoes a change in an electrical property thereof when deformed;
an electric circuit mounted above the functional layer, opposite the membrane, the electric circuit including an electrically-conductive elastic interface, and being arranged to receive and analyze an electric signal indicative of the change in the electrical property of the functional layer; and
a solder layer forming a direct electrical connection between the elastic interface and the at least one electric terminal, in addition to forming a mounting connection of the electric circuit.
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Abstract
A high-pressure sensor device has a pressure sensor element and an electric circuit, in particular in the form of a semiconductor component, the pressure sensor element having a membrane deformable under the effect of pressure, and a functional layer, which experiences a change in its electrical properties when deformed, and which has at least one electric terminal area, and the design and the manufacturing process being simplified in particular by the fact that the semiconductor component is directly connected to the electric terminal area via a solder layer.
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Citations
30 Claims
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1. A high-pressure sensor device, comprising:
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a pressure sensor element including a membrane deformable under pressure and a functional layer mechanically coupled to the membrane, wherein the functional layer includes at least one electric terminal area and the functional layer undergoes a change in an electrical property thereof when deformed; an electric circuit mounted above the functional layer, opposite the membrane, the electric circuit including an electrically-conductive elastic interface, and being arranged to receive and analyze an electric signal indicative of the change in the electrical property of the functional layer; and a solder layer forming a direct electrical connection between the elastic interface and the at least one electric terminal, in addition to forming a mounting connection of the electric circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for manufacturing a high-pressure sensor device, comprising:
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forming an electrically-conductive elastic interface on an electric circuit; mounting the electric circuit above a functional layer of the sensor device; connecting the electric circuit to terminal areas of a functional layer in such a way that solder is first applied to one of two elements including the interface and the functional layer; and then joining and soldering the two elements using a soldering procedure, so as to form an electrical connection between the two elements, wherein the soldering also forms a mounting connection of the electric circuit. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification