Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus

• US 7,803,516 B2
• Filed: 11/20/2006
• Issued: 09/28/2010
• Est. Priority Date: 11/21/2005
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Nagasaka, Hiroyuki
• Primary Examiner(s): Duda; Kathleen
• Application Number:
  US11/601,777
• Publication Number:
  US 20070172767A1
• Time in Patent Office: 1,408 Days
• Field of Search: 430/311, 430/394
• US Class Current: 430/311
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70991 Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Abstract

An exposure method for exposing a predetermined area on a substrate includes an operation for executing first exposure for the predetermined area by forming a liquid immersion area of a first liquid on the substrate, and an operation for executing second exposure for the predetermined area by forming a liquid immersion area of a second liquid different from the first liquid, on the substrate on which the first exposure has been executed, wherein the surface state of the substrate in the second exposure is allowed to differ from the surface state of the substrate in the first exposure. Even when the substrate is subjected to the first exposure and the second exposure by using the liquid immersion method, then the liquid immersion area of the liquid can be satisfactorily formed on the substrate in each of the exposure processes, and the substrate can be exposed satisfactorily.

Claims

1. An exposure method for exposing a predetermined area on a substrate, the exposure method comprising:

executing first exposure for the predetermined area by forming a liquid immersion area of a first liquid on the substrate;

executing second exposure for the predetermined area by forming a liquid immersion area of a second liquid different from the first liquid, on the substrate on which the first exposure has been executed; and

making a surface state of the substrate in the second exposure different from a surface state of the substrate in the first exposure depending on the first and second liquids.

2. The exposure method according to claim 1, wherein:

a surface of the substrate includes a surface of a film formed on a base material of the substrate; and

the film used in the first exposure is different from the film used in the second exposure.

3. The exposure method according to claim 2, wherein the base material includes a semiconductor wafer.

4. The exposure method according to claim 2, wherein the film includes at least one of a film of a photosensitive material and a predetermined film which covers the film of the photosensitive material.

5. The exposure method according to claim 4, wherein:

the predetermined film, which is used in the first exposure, is a first predetermined film; and

the predetermined film, which is used in the second exposure, is a second predetermined film.

6. The exposure method according to claim 5, further comprising:

performing an operation for developing the substrate by using a developing solution after completion of the second exposure, wherein the second predetermined film is soluble in the developing solution.

7. The exposure method according to claim 5, wherein:

the first predetermined film is determined depending on the first liquid; and

the second predetermined film is determined depending on the second liquid.

8. The exposure method according to claim 5, wherein the predetermined film is used in at least one of the first exposure and the second exposure.

9. The exposure method according to claim 5, wherein at least one of an operation for forming the predetermined film on the film of the photosensitive material on the base material and an operation for removing the predetermined film disposed on the film of the photosensitive material on the base material is executed between the first exposure and the second exposure.

10. The exposure method according to claim 9, wherein the operation for removing the predetermined film, which is performed between the first exposure and the second exposure, includes an operation for removing the first predetermined film having been used in the first exposure.

11. The exposure method according to claim 10, wherein the first predetermined film, used in the first exposure, is formed on the film of the photosensitive material.

12. The exposure method according to claim 11, wherein:

the operation for forming the predetermined film, which is performed between the first exposure and the second exposure, includes an operation for removing the first predetermined film and then forming the second predetermined film on the film of the photosensitive material; and

the second exposure is executed by using the second predetermined film.

13. The exposure method according to claim 11, wherein the second exposure is executed without using the second predetermined film after removing the first predetermined film.

14. The exposure method according to claim 13, wherein the first predetermined film is removed by using the second liquid.

15. The exposure method according to claim 10, wherein the first predetermined film, used in the first exposure, is formed on the second predetermined film which covers the film of the photosensitive material, and the second exposure is executed by using the second predetermined film after removing the first predetermined film.

16. The exposure method according to claim 15, wherein the first predetermined film is removed by using the second liquid.

17. The exposure method according to claim 9, wherein the operation for forming the predetermined film, which is performed between the first exposure and the second exposure, includes an operation for forming the second predetermined film on the first predetermined film having been used in the first exposure.

18. The exposure method according to claim 9, wherein:

the first exposure is executed without using the predetermined film; and

the operation for forming the predetermined film, which is performed between the first exposure and the second exposure, includes an operation for forming the second predetermined film on the film of the photosensitive material.

19. The exposure method according to claim 1, wherein the substrate, for which the first exposure has been performed, is not developed between the first exposure and the second exposure.

20. The exposure method according to claim 1, wherein the first exposure is performed in a first station, and the second exposure is performed in a second station which is different from the first station.

21. The exposure method according to claim 20, wherein both of the first station and the second station exist in a same chamber.

22. The exposure method according to claim 21, wherein both of the first exposure and the second exposure are performed on a same substrate stage which is movable while holding the substrate.

23. The exposure method according to claim 1, wherein the predetermined area on the substrate is subjected to multiple exposure including the first exposure and the second exposure.

30. A method for producing a device, comprising:

exposing a substrate by the exposure method as defined in claim 1;

developing the exposed substrate; and

processing the developed substrate.

31. The method for producing the device according to claim 30, wherein the substrate is subjected to multiple exposure including the first exposure and the second exposure.

24. An exposure method for exposing a predetermined area of a substrate, the exposure method comprising:

selecting a first liquid which is to be supplied onto the substrate in first exposure and a first film which is to be formed on the substrate and which makes contact with the first liquid in the first exposure;

selecting a second liquid which is to be supplied onto the substrate in second exposure and which is different from the first liquid and a second film which is to be formed on the substrate, which is different from the first film, and which makes contact with the second liquid in the second exposure;

forming a liquid immersion area of the first liquid on the substrate to execute the first exposure for the predetermined area; and

forming a liquid immersion area of the second liquid on the substrate, for which the first exposure has been executed, to execute the second exposure for the predetermined area.

25. The exposure method according to claim 24, further comprising forming the second film before the first exposure.

26. The exposure method according to claim 24, further comprising forming the second film after the first exposure.

27. The exposure method according to claim 24, wherein the first film is removed by the second liquid when the second exposure is performed, and the second film makes contact with the second liquid.

28. The exposure method according to claim 24, wherein the first exposure is performed in a first station, and the second exposure is performed in a second station which is different from the first station.

29. The exposure method according to claim 24, wherein both of the first exposure and the second exposure are performed on a same substrate stage which is movable while holding the substrate.

32. A substrate processing method for forming a film on a base material of a substrate on which first exposure and second exposure are to be performed, the substrate processing method comprising:

forming on the base material a first film, which is to make contact with a first liquid, before performing the first exposure through the first liquid; and

forming on the base material a second film, which is to make contact with a second liquid, before performing the second exposure through the second liquid, the second liquid being different from the first liquid and the second film being different from the first film.

33. The substrate processing method according to claim 32, wherein the base material includes a semiconductor wafer.

34. The substrate processing method according to claim 32, wherein the first and second films are determined depending on the first and second liquids respectively.

35. The substrate processing method according to claim 32, wherein each of the first and second films is one of a film of a photosensitive material and a predetermined film which covers the film of the photosensitive material.

36. The substrate processing method according to claim 32, wherein the substrate is developed after the second exposure without developing the substrate after the first exposure.

37. The substrate processing method according to claim 32, wherein the second film is soluble in a developing solution.

38. The substrate processing method according to claim 32, wherein the first film disposed on the base material is removed between the first exposure and the second exposure and/or the second film disposed on the base material is removed after the second exposure.

39. The substrate processing method according to claim 38, wherein the first film is a predetermined film which covers a film of a photosensitive material on the base material, and the predetermined film is removed between the first exposure and the second exposure.

40. The substrate processing method according to claim 39, wherein the second film is formed on the film of the photosensitive material after removing the first film.

41. The substrate processing method according to claim 39, wherein the first film is formed on the second film.

42. The substrate processing method according to claim 41, wherein the second film is formed on the film of the photosensitive material.

43. The substrate processing method according to claim 39, wherein the second film is the film of the photosensitive material.

44. The substrate processing method according to claim 32, wherein the second film is formed on the first film between the first exposure and the second exposure.

45. The substrate processing method according to claim 44, wherein the first film is a film of a photosensitive material formed on the base material.

46. The substrate processing method according to claim 32, wherein the first film is a predetermined film which covers a film of a photosensitive material on the base material, and the predetermined film is removed by using the second liquid.

47. The substrate processing method according to claim 32, wherein the substrate is subjected to multiple exposure which includes the first exposure and the second exposure.