Polarization-reversed III-nitride light emitting device
First Claim
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1. A structure comprising:
- a device structure comprising a III-nitride light emitting region disposed between a p-type region and an n-type region, the light emitting region comprising a wurtzite crystal structure; and
a non-III-nitride material disposed between two surfaces, wherein;
one of the surfaces is a surface of a wurtzite crystal portion of the device structure, the wurtzite crystal portion of the device structure comprising alternating layers of group III atoms and group V atoms, wherein the surface of the wurtzite crystal portion of the device structure comprises a surface of a layer of group III atoms; and
the other of the surfaces is a surface of a wurtzite crystal portion of a second structure, the wurtzite crystal portion of the second structure comprising alternating layers of group III atoms and group V atoms, wherein the surface of the wurtzite crystal portion of the second structure comprises a surface of a layer of group III atoms; and
the non-III-nitride material is in direct contact with the two surfaces;
wherein across an interface disposed between the light emitting region and the p-type region, a wurtzite c-axis, defined as pointing from a nitrogen face of a III-nitride unit cell to a group III atom face of the III-nitride unit cell, points toward the light emitting region.
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Abstract
A device structure includes a III-nitride wurtzite semiconductor light emitting region disposed between a p-type region and an n-type region. A bonded interface is disposed between two surfaces, one of the surfaces being a surface of the device structure. The bonded interface facilitates an orientation of the wurtzite c-axis in the light emitting region that confines carriers in the light emitting region, potentially increasing efficiency at high current density.
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Citations
16 Claims
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1. A structure comprising:
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a device structure comprising a III-nitride light emitting region disposed between a p-type region and an n-type region, the light emitting region comprising a wurtzite crystal structure; and a non-III-nitride material disposed between two surfaces, wherein; one of the surfaces is a surface of a wurtzite crystal portion of the device structure, the wurtzite crystal portion of the device structure comprising alternating layers of group III atoms and group V atoms, wherein the surface of the wurtzite crystal portion of the device structure comprises a surface of a layer of group III atoms; and the other of the surfaces is a surface of a wurtzite crystal portion of a second structure, the wurtzite crystal portion of the second structure comprising alternating layers of group III atoms and group V atoms, wherein the surface of the wurtzite crystal portion of the second structure comprises a surface of a layer of group III atoms; and the non-III-nitride material is in direct contact with the two surfaces; wherein across an interface disposed between the light emitting region and the p-type region, a wurtzite c-axis, defined as pointing from a nitrogen face of a III-nitride unit cell to a group III atom face of the III-nitride unit cell, points toward the light emitting region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification