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Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer

  • US 7,804,148 B2
  • Filed: 02/16/2006
  • Issued: 09/28/2010
  • Est. Priority Date: 02/16/2006
  • Status: Expired due to Fees
First Claim
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1. A structure comprising:

  • a microelectronic structure having a substrate and a plurality of layers, each layer having an upper and a lower surface and four sidewall surfaces, each said upper and lower surface defining a flat area,a thermal dissipative layer having a thickness of from about 500 to 1500 Å

    , selected from the group consisting of a thermally dissipative diamond-like carbon material, titanium, tungsten, tantalum, and nitrides and silicides and alloys thereof, the lower surface area of said thermal dissipative layer located over and being in spatially continuous contact with all or a portion of an upper surface area of said substrate, wherein said substrate is selected from the group consisting of a bulk semiconductor substrate, a semiconductor-on-insulator substrate, and a hybrid semiconductor substrate comprising at least one bulk semiconductor region and at least one semiconductor-on-insulator region;

    a reflective layer having a thickness of from about 500 to 1000 Å

    , and being a non-refractory metal material selected from the group consisting of aluminum metal material and copper metal material, the lower surface area of said reflective layer being located over and in spatially continuous contact with the upper surface area of said thermal dissipative layer and said reflective layer is located upon the entirety of said area of said thermal dissipative layer; and

    a dielectric transparent capping layer selected from the group consisting of indium-tin oxide, silicon oxide, silicon nitride and silicon oxynitride having a thickness of from about 10 to 100 Å

    , said dielectric transparent capping layer located directly upon said reflective layer, such that the lower surface area of said dielectric transparent capping layer is located over and in spatially continuous spatial contact with the upper surface area of said reflective layer wherein a given sidewall of each of said thermal dissipative layer, said reflective layer and said transparent capping layer is aligned with respect to one another.

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