Apparatus including processor
First Claim
1. An apparatus comprising:
- a processor comprising a major surface, wherein said processor generates heat when energized;
a heat dissipation plate comprising a thermally conductive material, and including a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion, wherein the heat dissipation plate is adapted to dissipate heat from the processor;
an array of pins, wherein the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate; and
a heat dissipating material contacting the heat dissipation plate and the major surface of the processor, wherein the heat dissipating material does not contact the second portion of the heat dissipating plate,wherein the pins are configured to be received in a socket assembly on a circuit board.
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Accused Products
Abstract
An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.
98 Citations
13 Claims
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1. An apparatus comprising:
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a processor comprising a major surface, wherein said processor generates heat when energized; a heat dissipation plate comprising a thermally conductive material, and including a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion, wherein the heat dissipation plate is adapted to dissipate heat from the processor; an array of pins, wherein the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate; and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor, wherein the heat dissipating material does not contact the second portion of the heat dissipating plate, wherein the pins are configured to be received in a socket assembly on a circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification