Dual stage modular optical devices

• US 7,805,084 B2
• Filed: 05/20/2005
• Issued: 09/28/2010
• Est. Priority Date: 05/20/2004
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Togami, Chris K., Sasser, Gary
• Primary Examiner(s): Liu; Li
• Application Number:
  US11/134,532
• Publication Number:
  US 20050271391A1
• Time in Patent Office: 1,957 Days
• Field of Search: 398135-139, 398/164, 398/208, 385/14, 385/53, 385 88- 94, 439/76, 439/76.1, 439/607
• US Class Current: 398/164
• CPC Class Codes: G02B 6/3897 Connectors fixed to housings, casing, frames or circuit boards G02B6/44528 takes precedence
• CPC Class Codes: H04B 10/40 Transceivers

Abstract

Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.

Claims

1. A modular optical device, comprising:

a first fabricated package including an optoelectronic component;

a second fabricated package defining an opening that permits insertion of circuitry therethrough, the circuitry being configured to electrically interoperate with the optoelectronic component; and

a lead frame that extends from a first end of the opening to a second end of the opening, that mechanically connects the first fabricated package to the second fabricated package, and that electrically connects the optoelectronic component to contacts exposed in the opening, wherein;

in a first configuration of the modular optical device, the first fabricated package is spaced apart from the second fabricated package by a portion of the lead frame that mechanically connects the packages;

in a second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent to position one of the first and second fabricated packages on top of the other; and

in the second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent no more than twice to position the first and second fabricated packages on top of one another.

2. The modular optical device as recited in claim 1, wherein the optoelectronic device comprises at least one of a light source for generating optical signals and a light detector for detecting optical signals.

3. The modular optical device as recited in claim 1, further comprising:

one or more external connectors mechanically coupled to the second fabricated package, the one or more external connectors facilitating mechanical and/or electrical connections to external components.

4. The modular optical device as recited in claim 1, further comprising a lens block mechanically coupled to the first fabricated package, the lens block configured such that one or more lens pins can mechanically couple to the lens block.

5. The modular optical device as recited in claim 4, further comprising:

a lens pin mechanically coupled to the lens block, the lens pin for directing an optical signal between the optoelectronic device and a corresponding external component.

6. The modular optical device as recited in claim 1, wherein the optoelectronic device comprises a vertical cavity surface emitting laser.

7. The modular optical device as recited in claim 1, wherein the optoelectronic device comprises a photodiode.

8. The modular optical device recited in claim 1, wherein the second fabricated package encases portions of the lead frame that circumscribe the opening while leaving portions of the lead frame within the opening unencased to facilitate the insertion of circuitry.

9. An optoelectronic interface device comprising:

a host bus adapter having a printed circuit board with at least one connector for electrically interfacing with a host device; and

a modular optical device configured to mechanically and electrically interface with the host bus adapter, the modular optical device comprising;

a first fabricated package including at least one of a light source and a light detector;

a second fabricated package defining an opening that permits insertion of circuitry therethrough, the circuitry being configured to electrically interoperate with the at least one of a light source and light detector;

a lead frame including a first portion that mechanically connects the first fabricated package to the second fabricated package and that electrically connects the at least one of a light source and light detector to lead frame contacts exposed in the opening of the second fabricated package, the lead frame further including a second portion that provides a mechanical and/or electrical connection from the modular optical device to a host bus adapter external to the modular optical device;

a lens block mechanically coupled to the first fabricated package the lens block configured to receive one or more lens pins;

at least one lens pin mechanically coupled to the lens block, the at least one lens pin for transferring an optical signal between the at least one of a light source and a light detector and an external component, wherein;

in a first configuration of the modular optical device, the first fabricated package is spaced apart from the second fabricated package by a portion of the lead frame that mechanically connects the packages;

in a second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent to position one of the first and second fabricated packages on top of the other; and

in the second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent no more than twice to position the first and second fabricated packages on top of one another.

10. The optoelectronic interface device as recited in claim 9, wherein the host bus adapter includes components for converting between an optical signal and an electrical signal.

11. The optoelectronic interface device as recited in claim 10, wherein the host bus adapter includes at least one of a laser driver and a transimpedance amplifier.

12. The optoelectronic interface device as recited in claim 9, wherein the optoelectronic interface device is configured to be substantially received within a standard slot of the host device.

13. The optoelectronic interface device as recited in claim 12, wherein the standard slot comprises one of:

a PCI card slot and a PCMCIA card slot.

14. The optoelectronic interface device as recited in claim 9, wherein the host bus adapter comprises a printed circuit board for one of:

a peripheral component interconnect card and a PCMCIA card.

15. A modular optical device comprising:

a first fabricated package including a laser and a photodiode;

a second fabricated package defining an opening that permits insertion of circuitry therethrough, the circuitry being configured to electrically interoperate with the laser and the photodiode and the second fabricated package including a connector for electrically and mechanically coupling the second fabricated package to a substrate; and

a lead frame that extends from a first end of the opening to a second end of the opening, that mechanically connects the first fabricated package to the second fabricated package, and that electrically connects the laser and the photo diode to contacts exposed in the opening, wherein;

in a first configuration of the modular optical device, the first fabricated package is spaced apart from the second fabricated package b a portion of the lead frame that mechanically connects the packages;

in a second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent to position one of the first and second fabricated packages on top of the other; and

in the second configuration of the modular optical device, the mechanically connecting portion of the lead frame is bent no more than twice to position the first and second fabricated packages on top of one another.

16. The modular optical device recited in claim 15, wherein the first fabricated package includes an optoelectronic device electrically connected with the lead frame.

17. The modular optical device recited in claim 15, wherein the lead frame extends through an outer wall of the second fabricated package.