Inductor for a system-on-a-chip and a method for manufacturing the same
First Claim
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1. A method for manufacturing an inductor, the method comprising:
- forming a mold layer on a seed layer, wherein the mold layer comprises a plurality of hole arrays exposing the seed layer;
growing conductive patterns from the seed layer to fill the hole arrays by application of a plating process; and
continuing application of the plating process after the conductive patterns fill the hole arrays until protrusions form on each one of the conductive patterns to extend over the mold layer, and until the protrusions amalgamate into a single conductive line on the mold layer,wherein the single conductive line as formed by the amalgamated protrusions is arranged to form the inductor.
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Abstract
An inductor for a system-on-a-chip and a method for manufacturing the inductor are disclosed. The inductor comprises a conductive line formed by connecting a plurality of conductive patterns grown from a seed layer formed on a lower wiring. The method comprises using an electrolytic plating process or an electroless plating process to grow the plurality of adjacent conductive patterns from the seed layer until they become connected. The method also enables adjusting the height and width of the conductive line to desired levels.
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Citations
17 Claims
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1. A method for manufacturing an inductor, the method comprising:
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forming a mold layer on a seed layer, wherein the mold layer comprises a plurality of hole arrays exposing the seed layer; growing conductive patterns from the seed layer to fill the hole arrays by application of a plating process; and continuing application of the plating process after the conductive patterns fill the hole arrays until protrusions form on each one of the conductive patterns to extend over the mold layer, and until the protrusions amalgamate into a single conductive line on the mold layer, wherein the single conductive line as formed by the amalgamated protrusions is arranged to form the inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing an inductor, the method comprising:
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forming a mold layer on a substrate comprising a conductive structure, wherein the mold layer comprises hole arrays having inner surfaces; forming a diffusion prevention layer on the inner surfaces of the hole arrays and on the mold layer; forming seed layer patterns on portions of the diffusion prevention layer positioned in the hole arrays; growing conductive patterns from the seed layer patterns to fill the hole arrays by application of a plating process; continuing application of the plating process after the conductive patterns fill the hole arrays until protrusions form on each one of the conductive patterns to extend over the mold layer, and until the protrusions amalgamate into a single a conductive line on the mold layer; and forming a protection layer on the conductive line, wherein the conductive line formed by the amalgamated protrusions and as protected by the protection layer is arranged to form the inductor. - View Dependent Claims (13, 14, 15)
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16. A method of manufacturing an inductor, the method comprising:
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forming a mold layer on a substrate comprising a conductive structure, wherein the mold layer comprises hole arrays having inner surfaces; forming a diffusion prevention layer on the inner surfaces of the hole arrays and on the mold layer; forming a first seed layer on the diffusion prevention layer; forming a capping layer on the first seed layer; forming second seed layer patterns on portions of the capping layer positioned in the hole arrays; growing conductive patterns from the second seed layer patterns to fill the hole arrays by application of a plating process; continuing application of the plating process after the conductive patterns fill the hole arrays until protrusions form on each one of the conductive patterns to extend over the mold layer, and until the protrusions amalgamate into a single a conductive line on the mold layer; and forming a protection layer on the conductive line, wherein the conductive line as formed by the amalgamated protrusions and as protected by the protection layer is arranged to form the inductor. - View Dependent Claims (17)
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Specification