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Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods

  • US 7,807,505 B2
  • Filed: 08/30/2005
  • Issued: 10/05/2010
  • Est. Priority Date: 08/30/2005
  • Status: Active Grant
First Claim
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1. A method for packaging microfeature devices, the method comprising:

  • releasably attaching a plurality of first known good microelectronic dies to a generally rigid, temporary carrier substrate in a desired arrangement, wherein the carrier substrate is patterned with the desired arrangement before releasably attaching the first known good dies, and wherein the temporary carrier substrate has a form factor corresponding to a form factor of a semiconductor wafer;

    attaching one or more second known good microelectronic dies to the individual first dies in a stacked configuration to form a plurality of stacked devices;

    at least partially encapsulating the stacked devices; and

    separating the stacked devices from each other.

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