Solar cell fabrication using extrusion mask
First Claim
1. A method for fabricating an integrated circuit on a semiconductor substrate, the method comprising:
- aligning a mask between an extrusion head and the semiconductor substrate such that a first peripheral portion of the mask is positioned over a first peripheral area of the semiconductor substrate, a second peripheral portion of the mask is positioned over a second peripheral area of the semiconductor substrate, and a central opening defined between the first and second peripheral portions is positioned over a central area of the semiconductor substrate disposed between the first and second peripheral areas;
moving the extrusion head relative to the semiconductor substrate such that a plurality of outlet orifices defined in the extrusion head are moved from a first position over the first peripheral area to a second position over the second peripheral area, whereby such the plurality of outlet orifices pass over the central area of the semiconductor substrate; and
extruding a material such that said material is continuously extruded through the plurality of outlet orifices while the extrusion head is moved from the first position to the second position, whereby the extruded material forms a plurality of elongated extruded structures on the central area of the semiconductor substrate.
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Accused Products
Abstract
Large-area ICs (e.g., silicon wafer-based solar cells) are produced by positioning a mask between an extrusion head and the IC wafer during extrusion of a dopant bearing material or metal gridline material. The mask includes first and second peripheral portions that are positioned over corresponding peripheral areas of the wafer, and a central opening that exposes a central active area of the wafer. The extrusion head is then moved relative to the wafer, and the extrusion material is continuously extruded through outlet orifices of the extrusion head to form elongated extruded structures on the active area of the wafer. The mask prevents deposition of the extrusion material along the peripheral edges of the wafer, and facilitates the formation of unbroken extrusion structures. The mask may be provided with a non-rectangular opening to facilitate the formation of non-rectangular (e.g., circular) two-dimensional extrusion patterns.
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Citations
20 Claims
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1. A method for fabricating an integrated circuit on a semiconductor substrate, the method comprising:
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aligning a mask between an extrusion head and the semiconductor substrate such that a first peripheral portion of the mask is positioned over a first peripheral area of the semiconductor substrate, a second peripheral portion of the mask is positioned over a second peripheral area of the semiconductor substrate, and a central opening defined between the first and second peripheral portions is positioned over a central area of the semiconductor substrate disposed between the first and second peripheral areas; moving the extrusion head relative to the semiconductor substrate such that a plurality of outlet orifices defined in the extrusion head are moved from a first position over the first peripheral area to a second position over the second peripheral area, whereby such the plurality of outlet orifices pass over the central area of the semiconductor substrate; and extruding a material such that said material is continuously extruded through the plurality of outlet orifices while the extrusion head is moved from the first position to the second position, whereby the extruded material forms a plurality of elongated extruded structures on the central area of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 19)
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12. A method for fabricating an integrated circuit on a semiconductor substrate, the method comprising:
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aligning a mask between an extrusion head and the semiconductor substrate such that a first peripheral portion of the mask is positioned over a first peripheral area of the semiconductor substrate, and a central opening defined by the first peripheral portions is positioned over a central area of the semiconductor substrate; moving the extrusion head relative to the semiconductor substrate such that a plurality of outlet orifices defined in the extrusion head are moved from a first position over the first peripheral area to a second position, whereby such the plurality of outlet orifices pass over the central area of the semiconductor substrate; and extruding a material such that said material is continuously extruded through the plurality of outlet orifices while the extrusion head is moved from the first position to the second position, whereby the extruded material forms a plurality of elongated extruded structures on the central area of the semiconductor substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 20)
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Specification