Wireless chip

• US 7,808,090 B2
• Filed: 09/02/2005
• Issued: 10/05/2010
• Est. Priority Date: 09/09/2004
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Shionoiri, Yutaka
• Primary Examiner(s): Hu; Shouxiang
• Application Number:
  US11/661,106
• Publication Number:
  US 20070257292A1
• Time in Patent Office: 1,859 Days
• Field of Search: 257/679, 257/922, 257/531, 257/532, 257/72, 257/296, 257/E27.111
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 29/78612 for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
• CPC Class Codes: H01L 29/78648 arranged on opposing sides of the channel
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04B 5/22 Capacitive coupling
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

An ID tag capable of communicating data wirelessly, the size of which is reduced, and where the size of an IC chip is reduced, a limited area of the chip is effectively used, current consumption is reduced, and communication distance is prevented from decreasing. The ID tag of the invention includes an IC chip having an integrated circuit, a resonance capacitor portion and a storage capacitor portion, and an antenna formed over the IC chip so as to overlap at least partially with an insulating film interposed therebetween. The antenna, the insulating film and wirings or semiconductor films forming the integrated circuit are stacked, and one or both of capacitors in the resonance capacitor portion and the storage capacitor portion are formed by this stacked structure.

Claims

1. A wireless chip comprising:

an integrated circuit;

a resonance capacitor portion;

a storage capacitor portion; and

an antenna formed over the integrated circuit so as to overlap the integrated circuit with an insulating film interposed therebetween,

wherein the resonance capacitor portion and the storage capacitor portion overlap each other, and

wherein the antenna is used as one of two electrodes of a first capacitor in the resonance capacitor portion, and the other of the first capacitor is used as one electrode of a second capacitor in the storage capacitor portion.

2. A wireless chip comprising:

an integrated circuit;

a resonance capacitor portion;

a storage capacitor portion; and

an antenna formed over the integrated circuit so as to overlap the integrated circuit with a first insulating film interposed therebetween,

wherein the integrated circuit comprises a semiconductor film having an impurity region, a gate electrode formed over the semiconductor film with a gate insulating film interposed therebetween, a second insulating film formed over the gate electrode, at least one of a source electrode comprising a portion formed over the second insulating film and a drain electrode comprising a portion formed over the second insulating film, and the first insulating film formed over one of the source electrode and the drain electrode,

wherein the resonance capacitor portion and the storage capacitor portion overlap each other,

wherein capacitance of the storage capacitor portion is formed by a first wiring over the gate insulating film, a portion of the second insulating film, a second wiring over the second insulating film, and

wherein capacitance of the resonance capacitor portion is formed by the second wiring, a portion of the first insulating film and at least a portion of the antenna.

3. The wireless chip according to claim 2, wherein the first wiring is formed using the same material as the gate electrode and the second wiring is formed using the same material as one of the source electrode and the drain electrode.

4. A wireless chip comprising:

an integrated circuit,

a resonance capacitor portion;

a storage capacitor portion; and

an antenna formed over the integrated circuit so as to overlap the integrated circuit with an insulating film interposed therebetween,

wherein the resonance capacitor portion and the storage capacitor portion overlap each other, and

wherein the antenna is used as one of two electrodes of a first capacitor in the resonance capacitor portion, and the other of the two electrodes of the first capacitor is used as one electrode of a second capacitor in the storage capacitor portion.

5. The wireless chip according to claim 4, wherein the semiconductor film comprises an impurity region.