Test method of microstructure body and micromachine

• US 7,808,253 B2
• Filed: 11/30/2006
• Issued: 10/05/2010
• Est. Priority Date: 12/02/2005
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Tateishi, Fuminori, Izumi, Konami, Yamaguchi, Mayumi
• Primary Examiner(s): Dole; Timothy J
• Application Number:
  US11/565,135
• Publication Number:
  US 20070143048A1
• Time in Patent Office: 1,405 Days
• Field of Search: 324/76.51, 324/633, 324/637, 324/652, 216/61, 216/86
• US Class Current: 324/637
• CPC Class Codes: B81C 99/004 during manufacturing
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT

Abstract

It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.

Claims

1. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer provided between the first conductive layer and the second conductive layer, comprising the steps of:

supplying electric power to the microstructure body wirelessly through an antenna connected to the microstructure body;

detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body; and

etching the sacrifice layer to form a space between the first conductive layer and the second conductive layer after the detecting step.

5. The method for testing a microstructure body according to any one of claims 1 to 4, wherein a frequency or intensity of the electric power is changed, and a current flowing in the microstructure body is detected as the characteristic in relation to a change in frequency or intensity of the electric power.

6. The method for testing a microstructure body according to any one of claims 1 to 4, wherein the first conductive layer and the second conductive layer are provided in parallel.

7. The method for testing a microstructure body according to any one of claims 1 to 4, wherein the microstructure body forms a micromachine.

2. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the microstructure body to a power supply circuit;

supplying electric power to the microstructure body and the power supply circuit wirelessly through an antenna connected to the microstructure body and the power supply circuit;

detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body; and

etching the sacrifice layer to form a space between the first conductive layer and the second conductive layer after the detecting step.

3. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the microstructure body to a power supply circuit;

supplying electric power to the microstructure body and the power supply circuit wirelessly through an antenna connected to the microstructure body and the power supply circuit;

detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body and the power supply circuit; and

etching the sacrifice layer to form a space between the first conductive layer and the second conductive layer after the detecting step.

4. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the microstructure body to a control circuit;

connecting the control circuit to a power supply circuit;

supplying electric power to the microstructure body, the control circuit, and the power supply circuit wirelessly through an antenna connected to at least one of the microstructure body, the control circuit, and the power supply circuit;

detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body; and

etching the sacrifice layer to form a space between the first conductive layer and the second conductive layer after the detecting step.