Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices

• US 7,808,434 B2
• Filed: 08/09/2007
• Issued: 10/05/2010
• Est. Priority Date: 08/09/2006
• Status: Active Grant

• Current Assignee: Kyocera AVX Components Corporation (Kyocera Corporation)
• Original Assignee: AVX Corporation (Kyocera Corporation)
• Inventors: Dalmia, Sidharth, White, George E.
• Primary Examiner(s): Le; HoangAnh T
• Application Number:
  US11/836,670
• Publication Number:
  US 20080036668A1
• Time in Patent Office: 1,153 Days
• Field of Search: 343/700.MS, 343/895, 343/846
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/20 Resilient mountings
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabricated on preformed dielectric lids or overmolds, c) antennae structures fabricated as part of the dielectric wiring that constitutes the wireless module, d) antennae structures that are printed directly on the top of the finished RF module, and e) antennae structures printed directly on the dielectric layers adjacent to thin film wiring and embedded passive elements such as filters, diplexers and couplers.

Claims

1. A system for an organic antenna structure, comprising:

a first organic layer having a first portion and a second portion, the first portion including a first conductive layer that is patterned to form at least one passive device and the second portion including a second conductive layer that is patterned to form one or more interconnect traces, wherein the first conductive layer and the second conductive layer are electrically connected;

a second organic layer positioned over the first portion of the first organic layer, wherein the second organic layer and the first portion of the first organic layer sandwich the first conductive layer, and further wherein the second organic layer is not positioned over a substantial part of the second portion of the first organic layer; and

an antenna structure, wherein the antenna structure is electrically connected to one or more interconnect traces of the second conductive layer.

2. The system of claim 1, wherein the second organic layer and the first portion of the first organic layer form a module, wherein the second portion of the first organic layer forms a flexible interconnect between the module and the antenna structure.

3. The system of claim 1, further comprising a third organic cover layer positioned over the second portion of the first organic layer, wherein the third organic cover layer and the second portion of the first organic layer sandwiches the second conductive layer.

4. The system of claim 1, wherein the first organic layer is comprised of a thermoplastic material.

5. The system of claim 4, wherein the thermoplastic material includes polyimide, polyamide, acryllate, or liquid crystalline polymer (LCP).

6. The system of claim 1, wherein the antenna structure is positioned on a first surface of the second portion of the first organic layer.

7. The system of claim 6, wherein a reference ground plane is positioned on a second surface opposite the first surface of the second portion of the first organic layer.

8. A system for organic antenna structures, comprising:

a multilayer organic stackup, wherein the stackup includes;

a first organic layer having a conductive layer, wherein the conductive layer is patterned to form at least one passive device; and

a second organic layer positioned opposite the first organic layer, wherein the first and second organic layers sandwich the patterned conductive layer;

an antenna structure distinct and separate from the multilayer stackup; and

a flexible organic interconnect that electrically connects at least a portion of the conductive layer of the multilayer organic stackup and the antenna structure.

9. The system of claim 8, wherein the flexible organic interconnect is comprised of a thermoplastic material.

10. The system of claim 9, wherein the thermoplastic material includes polyimide, polyamide, acryllate, or liquid crystalline polymer (LCP).

11. The system of claim 8, wherein the flexible organic interconnect comprises a second dielectric layer, an organic cover layer, and a metallization layer disposed between the second dielectric layer and the organic cover layer.

12. The system of claim 11, further comprising at least one via that electrically connects the antenna structure to the metallization layer of the flexible organic interconnect.

13. The system of claim 8, wherein the antenna structure is formed on a first surface of the flexible organic interconnect.

14. The system of claim 13, wherein a reference ground plane is formed on a second surface opposite the first surface of the flexible organic interconnect.

15. A multilayer stackup, comprising:

a first organic layer having a first conductive layer adjacent to a first surface and a second conductive layer adjacent to a second surface opposite the first surface, wherein the first and second conductive layers are patterned to form at least one passive device and first parallel sections of an antenna structure;

a second organic layer positioned opposite the first surface of the first organic layer;

a third organic layer positioned opposite the second surface of the first organic layer, wherein the second and third organic layers sandwich the first organic layer; and

at least one first via originating at the first conductive layer and terminating at the second layer to electrically connect the first parallel sections of the antenna structure.

16. The multi-layer stackup of claim 15, wherein the at least one first via includes fillers for tuning a performance of the antenna structure.

17. The multi-layer stackup of claim 15, wherein one or both of the second or third organic layer includes a third conductive layer, wherein the third conductive layer is patterned to form a second parallel section of the antenna structure, and further comprising at least one second via electrically connecting the second parallel section to the first parallel sections of the antenna structure.

18. The multi-layer stackup of claim 15, wherein the first, second, and third organic layers share a first side surface, wherein the antenna structure is exposed at the first side surface.

19. The multi-layer stackup of claim 18, further comprising a plated through hole formed along the first side surface, wherein the antenna structure is electrically connected to the first side surface.

20. The multi-layer stackup of claim 15, wherein the first, second, and third organic layers comprise liquid crystalline polymer (LCP).

21. The multi-layer stackup of claim 15, further comprising an organic encapsulate or lid on an exterior surface of the second organic layer or the third organic layer, wherein the encapsulate or lid includes a second antenna structure.