Wiring board

• US 7,808,799 B2
• Filed: 04/25/2007
• Issued: 10/05/2010
• Est. Priority Date: 04/25/2006
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Saiki, Hajime, Kawabe, Tadahiko, Kuroda, Masao, Sugimoto, Yasuhiro, Yuri, Shinji, Origuchi, Makoto
• Primary Examiner(s): Levi; Dameon E
• Assistant Examiner(s): Aychillhum; Andargie M
• Application Number:
  US11/739,752
• Publication Number:
  US 20070263364A1
• Time in Patent Office: 1,259 Days
• Field of Search: 361/728, 361/765, 361/782, 361761-763, 257/668, 257/698, 174/250, 174/260
• US Class Current: 361/765
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/10712 Via grid array, e.g. via grid array capacitor
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Claims

1. A wiring board, comprising:

a core board including a core main surface, a core rear surface, an accommodation hole opening at least at the core main surface side and a core board main surface side conductor disposed on the core main surface;

a capacitor including a capacitor main surface, a capacitor rear surface, a plurality of via conductors whose one end is located at the capacitor main surface, a plurality of inner electrode layers connected to the plurality of via conductors and laminated with a dielectric layer interposed therebetween, and a capacitor main surface side electrode disposed on the capacitor main surface;

a resin filler which fills a gap between the capacitor accommodated in the accommodation hole and the core board so as to fix the capacitor to the core board, said resin filler made of an insulating material; and

a wiring laminated body comprising;

a lowermost resin insulating layer laminated on the core main surface and the capacitor main surface, wherein said lowermost resin insulating layer is formed with the resin filler using the same said insulating material, whereby the resin filler and the lowermost resin insulating layer are formed as a single unit, and

a structure in which an interlayer insulating layer and a conductor layer are alternately laminated on the lowermost resin insulating layer,

wherein the resin filler includes a main surface side wiring forming portion disposed at the core main surface and the capacitor main surface, and

wherein a main surface side connecting conductor is disposed on the main surface side wiring forming portion so as to connect the core board main surface side conductor to the capacitor main surface side electrode, which is connected to an end portion of the via conductor.

4. The wiring board according to claim 1,

wherein the capacitor main surface side electrode and the capacitor rear surface side electrode are disposed on an outer circumference portion of the capacitor.

5. The wiring board according to claim 1,

wherein the core board main surface side conductor is a plane-shaped conductor or a net-shaped conductor formed so as to surround an opening edge of the accommodation hole and is connected to a plurality of the through-hole conductors which is formed so as to penetrate both of the core main surface and the core rear surface.

6. The wiring board according to claim 1,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view, and

wherein the main surface side connecting conductor is a belt-like pattern disposed at least one each in each side of the capacitor.

7. The wiring board according to claim 1,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view, and

wherein the main surface side connecting conductor is a belt-like pattern disposed plurally in each side of the capacitor.

8. The wiring board according to claim 1,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view, and

the main surface side connecting conductor is a rectangular-frame like pattern which is formed so as to cover the whole region of the main surface side wiring forming portion.

9. The wiring board according to claim 1,

wherein the main surface side connecting conductor joins a side face and an obverse surface of the core board main surface side conductor.

10. The wiring board according to claim 1,

wherein the main surface side connecting conductor is a plating layer.

11. The wiring board according to claim 1,

wherein a concave portion generated in the main surface side connecting conductor is filled with an insulating material and the obverse surface of the concave portion is flattened.

12. The wiring board according to claim 1,

wherein the plurality of via conductors and the capacitor main surface side electrode are disposed directly under a generally central portion of an integrated circuit element, which is to be mounted on a surface of the wiring laminated body.

13. The wiring board according to claim 1,

wherein the capacitor main surface side electrode is formed in an outer circumference direction of the capacitor, directly under a generally central portion of the integrated circuit element to be mounted on a surface of the wiring laminated body and

wherein the capacitor main surface side electrode is connected to the core board main surface side conductor through the main surface side connecting conductor.

2. A wiring board, comprising:

a core board including a core main surface, a core rear surface, an accommodation hole opening at both of the core main surface and the core rear surface, a core board main surface side conductor disposed on the core main surface and a core board rear surface side conductor disposed on the rear main surface;

a capacitor including a capacitor main surface, a capacitor rear surface, a plurality of via conductors penetrating between the capacitor main surface and the capacitor rear surface, a plurality of inner electrode layers connected to the plurality of via conductors and laminated with a dielectric layer interposed therebetween, a capacitor main surface side electrode disposed on the capacitor main surface and connected to an end portion of the plurality of via conductors at the capacitor main surface side, and a capacitor rear surface side electrode disposed on the capacitor rear surface and connected to an end portion of the plurality of via conductors at the capacitor rear surface side;

a resin filler which fills a gap between the capacitor accommodated in the accommodation hole and the core board so as to fix the capacitor to the core board, said resin filler made of an insulating material;

a first wiring laminated body comprising;

a lowermost resin insulating layer laminated on the core main surface and the capacitor main surface, wherein said lowermost resin insulating layer is formed with the resin filler using the same said insulating material, whereby the resin filler and the lowermost resin insulating layer are formed as a single unit, and

a structure in which an interlayer insulating layer and a conductor layer are alternately laminated on the lowermost resin insulating layer, wherein an integrated circuit element is mountable to the first wiring laminated body; and

a second wiring laminated body having a structure in which an interlayer insulating layer and a conductor layer are alternately laminated on the core rear surface and the capacitor rear surface, wherein a motherboard is connectable with the second wiring laminated body,

wherein the resin filler includes a main surface side wiring forming portion disposed at the core main surface and the capacitor main surface,

wherein the resin filler includes a rear surface side wiring forming portion disposed at the core rear surface and the capacitor rear surface,

wherein a main surface side connecting conductor is disposed on the main surface side wiring forming portion so as to connect the core board main surface side conductor to the capacitor main surface side electrode, which is connected to an end portion of the via conductor at the capacitor main surface side, and

wherein a rear surface side connecting conductor is disposed on the rear surface side wiring forming portion so as to connect the core board rear surface side conductor and the capacitor rear surface side electrode, which is connected to an end portion of the via conductor at the capacitor rear surface side.

3. The wiring board according to claim 2,

wherein the via conductors includes a plurality of power supplying via conductors and a plurality of grounding via conductors,

wherein the plurality of inner electrode layers includes:

a plurality of first inner electrode layers connected to the plurality of power supplying via conductors and a plurality of second inner electrode layers connected to the plurality of grounding via conductors,

wherein the capacitor main surface side electrode includes;

a first capacitor main surface side electrode disposed on the capacitor main surface and is connected to an end of the plurality of power supplying via conductors; and

a second capacitor main surface side electrode disposed on the capacitor main surface and connected to an end of the plurality of grounding via conductors,

wherein the capacitor rear surface side electrode includes;

a first capacitor rear surface side electrode disposed on the capacitor rear surface and connected to an end of the plurality of power supplying via conductors; and

a second capacitor rear surface side electrode disposed on the capacitor rear surface and connected to an end of the plurality of grounding via conductors,

wherein the main surface side connecting conductor connecting a core board main surface side power supplying pattern serving as the core board main surface side conductor to the first capacitor main surface side electrode, and

wherein the rear surface side connecting conductor connecting a core board rear surface side grounding pattern serving as the core board rear surface side conductor and the second capacitor rear surface side electrode.

14. The wiring board according to claim 2,

wherein the capacitor main surface side electrode and the capacitor rear surface side electrode are disposed on an outer circumference portion of the capacitor.

15. The wiring board according to claim 2,

wherein the core board main surface side conductor is a plane-shaped conductor or a net-shaped conductor formed so as to surround an opening edge of the accommodation hole and is connected to a plurality of the through-hole conductors which is formed so as to penetrate both of the core main surface and the core rear surface.

16. The wiring board according to claim 2,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view, and

wherein the main surface side connecting conductor is a belt-like pattern disposed at least one each in each side of the capacitor.

17. The wiring board according to claim 2,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view,

wherein the main surface side connecting conductor is a belt-like pattern disposed plurally in each side of the capacitor.

18. The wiring board according to claim 2,

wherein the capacitor assumes a generally rectangular shape as viewed in a plane view, and

the main surface side connecting conductor is a rectangular-frame like pattern which is formed so as to cover the whole region of the main surface side wiring forming portion.

19. The wiring board according to claim 2,

wherein the main surface side connecting conductor joins a side face and an obverse surface of the core board main surface side conductor.

20. The wiring board according to claim 2,

wherein the main surface side connecting conductor is a plating layer.

21. The wiring board according to claim 2,

wherein a concave portion generated in the main surface side connecting conductor is filled with an insulating material and the obverse surface of the concave portion is flattened.

22. The wiring board according to claim 2,

wherein the plurality of via conductors and the capacitor main surface side electrode are disposed directly under a generally central portion of an integrated circuit element, which is to be mounted on a surface of the wiring laminated body.

23. The wiring board according to claim 2,

wherein the capacitor main surface side electrode is formed in an outer circumference direction of the capacitor, directly under a generally central portion of the integrated circuit element to be mounted on a surface of the wiring laminated body and

wherein the capacitor main surface side electrode is connected to the core board main surface side conductor through the main surface side connecting conductor.