Electronic module designed to be incorporated in a tire system comprising such a module, tire fitted with such a system and method of obtaining such a system

• US 7,810,387 B2
• Filed: 05/17/2007
• Issued: 10/12/2010
• Est. Priority Date: 05/19/2006
• Status: Active Grant

• Current Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Original Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Robert, Michel
• Primary Examiner(s): Caputo; Lisa M
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US11/804,099
• Publication Number:
  US 20070274030A1
• Time in Patent Office: 1,244 Days
• Field of Search: None
• US Class Current: 73/146
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 13/5808 formed by a metallic element crimped around the cable H01R4/185 takes precedence
• CPC Class Codes: H01R 13/5845 the strain relief being achieved by molding parts around cable and connections

Abstract

An electronic module designed to be incorporated in a tire, comprising a functional device, a support and at least one device for electrically connecting a wire and a device for mechanically fixing the wire, separate from the electrical connection device, for mechanically fixing the wire to the support.

Claims

1. An electronic module designed to be incorporated in a deformable element such as a tire, a patch for tire or a deformable element used in the suspension of a vehicle, comprising:

a functional device fixed to a support;

at least one electrical connection device for electrically connecting a wire to the functional device; and

a mechanical fixing device for mechanically fixing the wire to the support, separate from the electrical connection device, between a free section of the wire and a solder connection of the electrical connection device with the wire, wherein the mechanical fixing device is configured to fully take up forces exerted on the free section of the wire.

2. The module according to claim 1, wherein the mechanical fixing device comprises crimping means.

3. The module according to claim 1, wherein the mechanical fixing device comprises snap-fitting means.

4. The module according to claim 1, wherein the mechanical fixing device comprises gluing means.

5. The module according to claim 1, comprising:

a passage for the wire terminating at the electrical connection device, wherein the mechanical fixing device is positioned on the passage upstream of the electrical connection device.

6. The module according to claim 1, wherein the mechanical fixing device is shaped to be applied to an outer insulation of the wire.

7. An electronic system designed to be incorporated in a tire, comprising:

the module according to claim 1, wherein

the wire is at least one wire of the electronic system comprising a section linked to the module and the free section, wherein the linked section of the wire is connected to the electrical connection device and fixed to the module by means of the mechanical fixing device.

8. The system according to claim 7, comprising:

a jacket protecting the module and the linked section of the wire.

9. The system according to claim 8, wherein the jacket protects a part of the free section of the wire so as to form means of guiding the free section.

10. The system according to claim 9, wherein the guiding means guide the free section in a rectilinear manner.

11. The system according to claim 10, comprising:

two wires connected to the module, wherein the jacket is shaped such that the free sections of the two wires are roughly coaxial.

12. The system according to claim 9, wherein the guiding means are of increasing rigidity in the direction of the module.

13. The system according to claim 8, wherein the jacket is made of a resin molded onto the module and the wire.

14. The system according to claim 8, wherein the jacket is made up of a plurality of layers of resins of decreasing rigidity successively molded onto the module and the wire.

15. The system according to claim 8, wherein the jacket comprises a case containing the module and the resin filling the case.

16. The system according to claim 15, wherein the case is formed by two half-shells.

17. The system according to claim 8, wherein the jacket is roughly in the shape of a roller.

18. A vehicle tire that incorporates the electronic system according to claim 7.

19. A method of obtaining a system according to claim 7, wherein the wire is fixed before the solder connection is soldered.