Rapid conductive cooling using a secondary process plane
First Claim
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1. A method for thermally treating a substrate, comprising:
- providing a chamber having a rotatably levitating substrate support disposed therein;
transferring a substrate to the substrate support;
moving the substrate and the substrate support to a first position;
heating the substrate in the first position;
moving the substrate and the substrate support to a second position adjacent an active cooling means; and
cooling the substrate in the second position, wherein the first and second positions are disposed in opposing portions of the chamber.
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Abstract
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
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Citations
20 Claims
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1. A method for thermally treating a substrate, comprising:
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providing a chamber having a rotatably levitating substrate support disposed therein; transferring a substrate to the substrate support; moving the substrate and the substrate support to a first position; heating the substrate in the first position; moving the substrate and the substrate support to a second position adjacent an active cooling means; and cooling the substrate in the second position, wherein the first and second positions are disposed in opposing portions of the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for thermally treating a substrate, comprising:
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providing a substrate to a chamber at a first temperature; heating the substrate in a first time period to a second temperature; heating the substrate to a third temperature in a second time period; cooling the substrate to the second temperature in the second time period; and cooling the substrate to the first temperature in a third time period, wherein the second time period is less than about 2 seconds. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A method for thermally treating a substrate, comprising:
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providing a chamber having a vertically movable magnetic substrate support disposed therein; providing a substrate to the chamber at a first temperature; moving the substrate to a first position; heating the substrate in the first position in a first time period to a second temperature; heating the substrate to third temperature in a second time period; moving the substrate to a second position adjacent an active cooling means and cooling the substrate to the second temperature in the second time period; and cooling the substrate to the first temperature in a third time period, wherein the second time period is less than about 2 seconds. - View Dependent Claims (20)
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Specification