Multilayer composite body having an electronic function

• US 7,812,343 B2
• Filed: 03/31/2006
• Issued: 10/12/2010
• Est. Priority Date: 04/15/2005
• Status: Expired due to Fees

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Fix, Walter, Knobloch, Alexander, Ullmann, Andreas, Welker, Merlin
• Primary Examiner(s): Richards; N Drew
• Assistant Examiner(s): Lee; Kyoung
• Application Number:
  US11/911,429
• Publication Number:
  US 20080203383A1
• Time in Patent Office: 1,656 Days
• Field of Search: None
• US Class Current: 257/40
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10174 Diode
• CPC Class Codes: H10K 19/10 comprising field-effect transistors
• CPC Class Codes: H10K 19/202 Integrated devices comprising a common active layer

Abstract

A multilayer composite body has an electronic function, in particular, an electronic subassembly comprising a plurality of organic electronic components, such as transistors, diodes, capacitors and so on, having at least one common layer, e.g., a semiconductor layer and/or insulation layer, wherein the common layer may be superfluous in one or more of the components. There thus is provided a structure of an entire subassembly such as an RFID tag, wherein the entire tag with all of its components is implemented in one production process.

Claims

1. A multilayer composite body comprising;

a substrate;

a plurality of spaced first electrically conductive electrodes on the substrate each comprising a layer of a given material having a first work function;

a semiconductor layer on the substrate overlying and in contact with the plurality of electrodes;

an insulation layer of a first given material on and overlying the semiconductor layer and over lying at least a portion of the plurality of first electrodes;

a plurality of spaced second electrically conductive electrodes on at least the insulation layer and overlying the semiconductor layer, the second electrodes each comprising a layer of a second given material having a second work function different than the first work function;

the first and second electrodes, the insulation layer and the semiconductor layer forming at least one organic transistor and at least one organic diode;

the transistor and diode each comprising at least two electrically conductive electrode layers and at least one organic semiconductor layer in common with the transistor and diode between the at least two electrically conductive electrode layers.

2. The multilayer composite body as claimed in claim 1 wherein the first electrodes comprise a noble metal layer and the second electrodes comprise a base metal layer.

4. The multilayer as claimed in claim 1 wherein the first and second electrodes form an electrode and a counterelectrode.

5. The multilayer composite body as claimed in claim 1 which contains a plurality of different components including the transistor and diode and contains at least one further layer which is in common to the different electronic organic components and, although being essential in one of the components, constitutes a superfluous layer in another of the components.

6. The multilayer composite body as claimed in claim 1 wherein the first and second electrodes, the insulation layer and the semiconductor layer further form a capacitor.

7. The multilayer composite body as claimed in claim 1 wherein the first and second electrodes, the insulation layer and the semiconductor layer further form at least two diodes and one capacitor.

8. The multilayer composite body as claimed in claim 1 wherein the first and second electrodes, the insulation layer and the semiconductor layer form at least three different components, including said diode, a capacitor and said transistor.

9. The multilayer composite body as claimed in claim 1 wherein the first and second electrodes, the insulation layer and the semiconductor layer form at least four different types of components.

10. The multilayer composite body as claimed in claim 1 wherein the first and second electrodes, the insulation layer and the semiconductor layer form at least one electronic component selected from the group consisting of an electrical contact via, a resistor, an interconnect resistor, a coil, a capacitor and a rectifier in combination with said diode and said transistor.

11. The multilayer composite body as claimed in claim 1 wherein at least one of the layers is on a substrate in a continuous planar structure.

12. The multilayer composite body as claimed in claim 1 wherein at least one of the layers is printed.

13. The multilayer composite body as claimed in claim 1 comprising a plurality of further components wherein one of the layers has no functionality in one component and comprises a continuous planar structure.

14. The multilayer composite body as claimed in claim 1 further comprising a first plurality of components wherein one of the first plurality of components is a capacitor, the semiconductor layer being in common to a second plurality of components including the capacitor in which capacitor the semiconductor layer is superfluous.

3. The multilayer composite body as claimed in 2, wherein the base electrodes are copper and the noble electrodes are silver.

15. A multilayer composite body comprising:

a plurality of components on a substrate;

at least one component of the plurality of components comprising at least one layer; and

a second component of the plurality on the substrate and comprising said at least one layer and which said at least one layer is superfluous in the second component.

16. A multilayer composite body comprising;

at least two different electronic organic components;

each component comprising at least two conductive electrode layers and at least one organic semiconductor layer in common with the at least two different components between the at least two electrode layers;

the at least two electrode layers comprising two corresponding respective materials which have different work functions; and

at least one further layer which is common to the different electronic organic components and, although being essential in one of the components, constitutes a superfluous layer in the other component.

17. A multilayer composite body comprising;

at least four different types of electronic organic components;

each component comprising at least two conductive electrode layers and at least one organic semiconductor layer in common with the at least four components and lying between the at feast two electrode layers;

the at least two electrode layers comprising two corresponding respective materials which have different work functions.

18. A multilayer composite body comprising;

at least two different electronic organic components;

each component comprising at least two conductive electrode layers and at least one organic semiconductor layer in common with each component between the at least two electrode layers;

the at least two electrode layers comprising two corresponding respective materials which have different work functions;

wherein one of the layers has no functionality in one component and comprises a continuous planar structure.