Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus

• US 7,812,365 B2
• Filed: 12/12/2008
• Issued: 10/12/2010
• Est. Priority Date: 10/15/2003
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Murayama, Takashi
• Primary Examiner(s): Tran; Minh-Loan T
• Application Number:
  US12/334,272
• Publication Number:
  US 20090095960A1
• Time in Patent Office: 669 Days
• Field of Search: 257/98, 257/99, 257/E33.061, 257/E33.075, 257/714, 257/E33.058
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A heat dissipation member includes a first plate-shaped member and a second plate-shaped member. The first plate-shaped member has a first surface thermally connectable with a heat generating element and a second surface. The second plate-shaped member is thermally connected with the second surface of the first plate-shaped member. The first plate-shaped member and the second plate-shaped member form a laminated-plate-shaped member. The laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid. The second surface of the first plate-shaped member forms asperities thereon.

Claims

1. A semiconductor light emitting apparatus comprising:

a heat dissipation member to dissipate heat generated by a heat generating element, the heat dissipation member being formed of a first plate-shaped member and a second plate-shaped member that form a flow path for flowing cooling fluid between them; and

a plurality of light emitting elements that are mounted to be two-dimensionally arranged on a main surface of the heat dissipation member,

wherein said heat dissipation member defines an inlet for an intake of the cooling fluid and an outlet communicating with the inlet for an ejection of the cooling fluid,

wherein a plurality of protruding portions are formed on a surface of said first plate-shaped member inside said flow path, and

wherein said second plate-shaped member defines a fan-shaped recessed section that extends from said inlet and/or said outlet toward a center part of said second plate-shaped member substantially in a fan shape on a surface of said second plate-shaped member inside said flow path.

2. The semiconductor light emitting apparatus according to claim 1, wherein said plurality of protruding portions are arranged apart from each other in a bent manner such that line segments that successively connect the protruding portions closest to each other repeatedly change their direction from the inlet to the outlet of said flow path.

3. The semiconductor light emitting apparatus according to claim 1, wherein at least some of said plurality of protruding portions are formed between said light emitting elements.

4. The semiconductor light emitting apparatus according to claim 1, wherein at least some of said plurality of protruding portions are formed such that their centers are located between said light emitting elements and a substantially central part of said light emitting element.

5. The semiconductor light emitting apparatus according to claim 1, wherein said plurality of protruding portions are located at a substantially central part of and in the peripheries of the comers of the light emitting element.

6. The semiconductor light emitting apparatus according to claim 1, wherein an upper surface of the protruding portion is bonded with the surface of the second plate-shaped member.

7. The semiconductor light emitting apparatus according to claim 1, wherein said flow path is formed in a substantially circular or oval cross section.

8. The semiconductor light emitting apparatus according to claim 1, wherein said inlet and/or said outlet of the flow path is formed in an arc-shape.

9. The semiconductor light emitting apparatus according to claim 1, wherein a metal material containing Au coats attaching surfaces of said first plate-shaped member and said second plate-shaped member.

10. The semiconductor light emitting apparatus according to claim 1, wherein said second plated-shaped member defines a plurality of support pillars formed on a bottom of the fan-shaped recessed section.

11. The semiconductor light emitting apparatus according to claim 1, wherein said second plated-shaped member is positioned lower than said first plate-shaped member.