Shell type actuator
First Claim
Patent Images
1. A micromechanical resonator comprising:
- a substrate;
a partial curved shell clamped on an outside portion of the shell to the substrate, wherein the shell is formed entirely of a non-electro active material compatible with CMOS processes to resonate at RF frequencies or higher responsive to localized time variable heating of only a portion of the shell.
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Accused Products
Abstract
A micromechanical resonator is formed on a substrate. The resonator has a partial spherical shell clamped on an outside portion of the shell to the substrate. In other embodiments, a flat disc or other shape may be used. Movement is induced in a selected portion of the disc, inducing easily detectible out-of-plane motion. A laser is used in one embodiment to heat the selected portion of the disc and induce the motion. The motion may be detected by capacitive or interferometric techniques.
20 Citations
31 Claims
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1. A micromechanical resonator comprising:
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a substrate; a partial curved shell clamped on an outside portion of the shell to the substrate, wherein the shell is formed entirely of a non-electro active material compatible with CMOS processes to resonate at RF frequencies or higher responsive to localized time variable heating of only a portion of the shell. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A micromechanical resonator comprising:
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a substrate; a partial curved shell consisting of a non-electro-active CMOS process compatible material clamped on an outside portion of the shell to the substrate; and means for inducing movement of the shell. - View Dependent Claims (13, 14, 15, 16)
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17. A micromechanical resonator comprising:
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a substrate; a CMOS process compatible curved disc clamped on an outside portion of the disc to the substrate; means for inducing movement of the disc; and means for detecting movement of the disc. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A micromechanical resonator comprising:
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a substrate; a partial curved shell clamped on an outside portion of the shell to the substrate, wherein the shell is formed of a CMOS compatible material and has an opening on the center, the shell to resonate at RF frequencies or higher; and a heater positioned proximate the shell to create a time varying temperature gradient across the shell to cause the shell to resonate. - View Dependent Claims (29, 30, 31)
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Specification