Integrated circuit package with glass layer and oscillator

• US 7,812,683 B2
• Filed: 07/14/2006
• Issued: 10/12/2010
• Est. Priority Date: 10/15/2002
• Status: Expired due to Term

• Current Assignee: Marvell Asia Pte Limited (Marvell Technology Group Limited)
• Original Assignee: Marvell World Trade Limited (Marvell Technology Group Limited)
• Inventors: Sutardja, Sehat
• Primary Examiner(s): Pascal; Robert
• Assistant Examiner(s): Gannon; Levi
• Application Number:
  US11/486,898
• Publication Number:
  US 20060255457A1
• Time in Patent Office: 1,551 Days
• Field of Search: 331/108.C, 331/44, 331/68, 331/176, 438/125, 257/528, 257/704
• US Class Current: 331/176
• CPC Class Codes: G11C 5/00 Details of stores covered by group G11C11/00
• CPC Class Codes: G11C 5/143 Detection of memory cassette insertion or removal; Continuity checks of supply or ground lines; Detection of supply variations, interruptions or levels G11C5/148 takes precedence; Switching between alternative supplies G11C5/141 takes precedence
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H03B 5/04 Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
• CPC Class Codes: H03B 5/36 active element in amplifier being semiconductor device H03B5/323, H03B5/326 , H03B5/38 take precedence
• CPC Class Codes: H03L 1/026 by using a memory for digitally storing correction values H03L1/025 takes precedence
• CPC Class Codes: H03L 1/027 by using frequency conversion means which is variable with temperature, e.g. mixer, frequency divider, pulse add/substract logic circuit H03L1/023, H03L1/026 take precedence
• CPC Class Codes: H03L 1/04 Constructional details for maintaining temperature constant
• CPC Class Codes: H03L 7/07 using several loops, e.g. for redundant clock signal generation
• CPC Class Codes: H03L 7/0891 the up-down pulses controlling source and sink current generators, e.g. a charge pump
• CPC Class Codes: H03L 7/099 : concerning mainly the controlled oscillator of the loop
• CPC Class Codes: H03L 7/1976 : using a phase accumulator for controlling the counter or frequency divider

Abstract

An integrated circuit package comprises an integrated circuit that comprises a temperature sensor that senses a temperature of the integrated circuit. A memory module stores oscillator calibrations and selects one of the oscillator calibrations as a function of the sensed temperature. An oscillator module generates a reference signal having a frequency that is based on the selected one of the oscillator calibrations. An epoxy layer adheres a glass layer to the integrated circuit. A packaging material encases at least part of the glass layer and the integrated circuit.

Claims

1. An integrated circuit package, comprising:

an integrated circuit to include;

a temperature sensor to sense a temperature of said integrated circuit;

a memory module to store oscillator calibrations and to select one of the oscillator calibrations as a function of the sensed temperature; and

an oscillator module to generate a reference signal having a frequency that is based on the selected one of the oscillator calibrations;

a glass layer;

an epoxy layer to adhere the glass layer to the integrated circuit; and

a packaging material to encase at least part of the glass layer and the integrated circuit,

wherein the glass layer is arranged between the packaging material and the oscillator module, and

wherein the glass layer includes a cavity that defines an air gap and wherein the cavity is adjacent to portions of the integrated circuit that include the oscillator module.

2. The integrated circuit package of claim 1, wherein the oscillator module includes an on-chip inductor and wherein the glass layer is located adjacent to portions of the integrated circuit that include the on-chip inductor.

3. An integrated circuit package, comprising:

an integrated circuit to include;

a temperature sensor to sense a temperature of said integrated circuit;

a memory module to store oscillator calibrations and to select one of the oscillator calibrations as a function of the sensed temperature; and

an oscillator module to generate a reference signal having a frequency that is based on the selected one of the oscillator calibrations;

a glass layer;

an epoxy layer to adhere the glass layer to the integrated circuit; and

a packaging material to encase at least part of the glass layer and the integrated circuit,

wherein the glass layer is arranged between the packaging material and the oscillator module, and

wherein the glass layer includes a cavity that defines an air gap and wherein the cavity is adjacent to portions of the integrated circuit that include an inductor of the oscillator module.

4. A method for providing an integrated circuit package comprising:

sensing a temperature of an integrated circuit;

storing oscillator calibrations;

selecting one of the oscillator calibrations as a function of the sensed temperature;

generating a reference signal having a frequency that is based on the selected one of the oscillator calibrations at an oscillator;

attaching a glass layer to the integrated circuit; and

encasing at least part of the glass layer and the integrated circuit in a packaging material,

wherein the glass layer is arranged between the packaging material and the oscillator, and

wherein the glass layer includes a cavity that defines an air gap and further comprising locating the cavity adjacent to portions of the integrated circuit that include the oscillator.

5. The method of claim 4, wherein the oscillator includes an on-chip inductor and further comprising locating the glass layer adjacent to portions of the integrated circuit that include the on-chip inductor.

6. A method for providing an integrated circuit package comprising:

sensing a temperature of an integrated circuit;

storing oscillator calibrations;

selecting one of the oscillator calibrations as a function of the sensed temperature;

generating a reference signal having a frequency that is based on the selected one of the oscillator calibrations at an oscillator;

attaching a glass layer to the integrated circuit; and

encasing at least part of the glass layer and the integrated circuit in a packaging material,

wherein the glass layer is arranged between the packaging material and the oscillator, and

wherein the glass layer includes a cavity that defines an air gap and further comprising locating the cavity adjacent to portions of the integrated circuit that include an inductor of the oscillator.