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Sensing arrangement

  • US 7,813,534 B2
  • Filed: 01/22/2004
  • Issued: 10/12/2010
  • Est. Priority Date: 01/22/2003
  • Status: Active Grant
First Claim
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1. A sensor arrangement comprising at least one sensor, at least one integrated signal processing circuit for the measurement of signals from the at least one sensor, and interconnecting wiring between the at least one sensor and the integrated circuit, the arrangement comprises a substrate, said substrate forming at least part of said interconnecting wiring and said substrate is further arranged to serve as a functional part of at least one said sensor, and wherein said substrate comprises means for forming a sensor together with a sensor part, wherein said substrate and said sensor part are galvanically separated, and wherein said substrate and said sensor part comprise means for transferring energy and measurement information inductively between said substrate and said sensor part.

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